Izicelo ze-foil yethusi ekufakweni kwe-chip

I-Copper FoilKuya ngokuya kubaluleke kakhulu ekufakweni kwe-chip ngenxa yokusebenza kwayo kagesi, ukuvumelanisa okushisayo, ukucubungula kanye nokusebenza kwezindleko. Nakhu ukuhlaziya okuningiliziwe kwezinhlelo zalo ezithile ekufakweni kweChip:

1. Isibopho socingo sethusi

• Ukufakwa esikhundleni kwegolide noma i-aluminium wire: Ngokwesiko, izintambo zegolide noma ze-aluminium zisetshenzisiwe ekufakweni kwe-chip ku-Electrically xhuma ngokujikeleza kwangaphakathi kwe-Chip kuya ku-Levent yangaphandle. Kodwa-ke, ngentuthuko ebukhwini bokucubungula ithusi kanye nokucatshangelwa kwezindleko, i-foil foil ne-zethusi ture kuba ukukhetha okujwayelekile. Ukusebenza kukagesi kaPopper cishe ngama-85-95% egolide, kepha izindleko zalo zicishe zibe yishumi, zikwenza kube yikhetho oluhle lokusebenza okuphezulu nokusebenza kahle kwezomnotho.
• Ukuthuthukiswa Kokwenza Kagesi Okuthuthukisiwe: I-Copper Wire Bonding inikeza ukumelana okuphansi kanye nokuvuselelwa okungcono okungcono kakhulu ezisetshenzisweni eziphezulu kanye nezicelo eziphezulu zamanje, ukunciphisa ukulahleka kwamandla ku-Interconnections ekwenzeni ngcono ukusebenza kukagesi ngokuphelele. Ngakho-ke, ukusebenzisa i-foil ye-Copper njengezinto ezisebenzayo ezinqumweni ze-bonding kungathuthukisa ukusebenza kahle kanye nokwethenjwa ngaphandle kokukhulisa izindleko.
• Isetshenziswe kuma-elektrodi kanye nama-micro-bumps: Ekuhanjisweni kwe-Flip-chip, i-chip ichithwe ukuze kufakwe / ukuphuma (i / o) pads ebusweni bayo kuxhumeke ngokuqondile kumjikelezo ophansi kwephakethe. I-Font Foil isetshenziselwa ukwenza ama-electrodes nama-micro-bumps, athengiswa ngokuqondile engxenyeni engezansi. Ukumelana okuphansi okushisayo kanye nokuvuselelwa okuphezulu kwethusi kuqinisekisa ukudluliswa okusebenzayo kwezimpawu namandla.
• Ukuthembeka nokuphathwa okushisayo: Ngenxa yokumelana kwayo okuhle kuma-electromigration kanye namandla emishini, ithusi lihlinzeka ngokuthembekile okungcono ngaphansi kwemijikelezo ehlukahlukene ehlukahlukene kanye nokuncipha kwamanje. Ngaphezu kwalokho, ukuhanjiswa okuphezulu kweCopper kusiza ukushisa ngokushesha okukhiqizwe ngesikhathi sokusebenza kwe-chip kuya echibini elingaphansi noma lokushisa, ukuthuthukisa amandla okuphathwa okushisayo kwephakeji.
• I-Lead Frame Izinto: I-Copper FoilKusetshenziswa kabanzi ekuphaketheni kohlaka lwe-Load, ikakhulukazi ukufakwa kwamadivayisi wedivayisi. Uhlaka oluholayo lunikeza ukwesekwa okuhlelekile kanye nokuxhumeka kukagesi kwe-chip, okudinga izinto zokwenziwa okuphezulu nokuvuselelwa okuhle okushisayo. I-Copper Foil ihlangabezana nalezi zidingo, inciphise izindleko zokupakisha ngenkathi kuthuthukisa ukufelwa kwe-thermal kanye nokusebenza kukagesi.
• Amasu wezokwelapha angaphezulu komhlaba: Kuzinhlelo zokusebenza ezisebenzayo, i-foil yethusi zivame ukuba ngaphansi kokwelashwa okungaphezulu njenge-nickel, i-tin, noma i-spelating yesiliva ukuvikela i-oxidation futhi uthuthukise ukuzungulwa. Lezi zindlela zokwelashwa ziphinde zithuthukise ukuqina kanye nokwethenjwa kwe-foil yethusi ekuphaphekeni kohlaka lwe-Lour.
• Impahla evutha amamojula ama-multi-chip: Ubuchwepheshe bePhathisi-in-Package buhlanganisa ama-chip amaningi nezinto ezingenamizwa kwiphakheji elilodwa ukufezekisa ukuhlanganiswa okuphezulu kanye nobuningi obusebenzayo. I-Copper Foil isetshenziselwa ukwenza amasekethe angaphakathi okuxhumanisa futhi isebenza njengendlela yamanje yokuvula. Lolu hlelo lokusebenza ludinga ukuthi i-Fost Foil ibe nokuvuselelwa okuphezulu nezici ze-Ultra-mncane ukufezekisa ukusebenza okuphezulu endaweni yokufaka okulinganiselwe.
• Izicelo ze-RF ne-Milimeter-Wave Application: I-Folip Foil nayo idlala indima ebaluleke kakhulu kumaseliphu yokuhambisa amava aphezulu aphezulu e-SIP, ikakhulukazi ku-Radio Frequency (RF) kanye nezinhlelo zokusebenza ze-millimeter-wave. Izici zalo zokulahleka okuphansi nokuvuselelwa okuhle kakhulu kuvumela ukuthi kuncishiswe i-attiation yesiginali ngempumelelo futhi kuthuthukise ukusebenza kahle kokudlulisela kulawa ma-application afudumele.
• Isetshenziswe ezingxenyeni zokusatshalaliswa kabusha (i-RDL): Ekupakishelwe kwabalandeli, i-foil ye-Copper isetshenziselwa ukwakha ungqimba kabusha wokwabiwa kabusha, ubuchwepheshe obusabalalisa kabusha kabusha i-chip i / o endaweni enkulu. Ukuvuselelwa okuphezulu nokunamathela okuhle kweCopper Foil kwenza kube yinto efanelekile yokwakha izingxenye zokwabiwa kabusha, okwandiswe i / o density kanye nokuxhasa ukuhlanganiswa okuningi kwe-chip.
• Ukuncishiswa kosayizi nobuqotho besiginali: Ukusetshenziswa kwe-Fopper Foil kuHardisty Wears kusiza ukunciphisa usayizi wephakeji ngenkathi kuthuthukisa ukuhanjiswa kwesiginali kanye nesivinini, okubaluleke kakhulu kumadivayisi eselula kanye nezicelo eziphezulu zekhompyutha ezidinga ukufakwa okuningana kokupakisha nokusebenza okuphezulu.
• Ukushisa kwe-Post Foil kucwila neziteshi ezishisayo: Ngenxa yokuvuselelwa okungcono kakhulu kwe-thermal, i-foil yethusi ivame ukusetshenziswa emasinki okushisa, iziteshi ezishisayo, nezinto ezibonakalayo ezishisayo ngaphakathi kwezinto ezisetshenziswayo zokufaka ngokushesha ukudlulisa ukushisa okwenziwe yi-chip ezakhiweni ezipholile zangaphandle. Lolu hlelo lokusebenza lubaluleke kakhulu kuma-high-Power Chips kanye namaphakheji adinga ukulawulwa kokushisa okuqondile, njengama-CPU, GPUS, kanye nama-Chips Amandla.
• Isetshenziswe kubuchwepheshe be-silicon nge (TSV) ubuchwepheshe: Kubuchwepheshe bokupakisha we-2.5D ne-3D ne-3D, i-foil yethusi isetshenziselwa ukwakha impahla yokugcwalisa ye-wis-silicon, ukuhlinzeka ngokuxhumeka okuqondile phakathi kwama-chip. Ukuvuselelwa okuphezulu kanye nokusebenza kwe-Foil Foil kwenza kube yinto ethandwayo kulobu buchwepheshe bokupakisha obuthuthukisiwe, ukusekela ukuhlanganiswa okuphezulu kwe-density kanye nezindlela zesiginali emfushane, ngaleyo ndlela kuthuthukiswe ukusebenza kohlelo lonke.

2. Ukupakishwa kwe-Chip-Chip

3. Ukuhanjiswa kohlaka lwe-Load

4. Iphakethe le-System (SIP)

5. Ukupakishwa okulandelwayo

6. Ukuphathwa kwe-Thermal kanye nezicelo zokunciphisa ukushisa

7. Ubuchwepheshe bokupakisha obuthuthukisiwe (njenge-2.5D ne-3D Packal)

Sekukonke, ukusetshenziswa kwe-Folip Foil ekuhanjisweni kweChip akunqunyelwe ekuxhumaneni kwendabuko kanye nokuphathwa kwe-Thermal kodwa kunwebe kubuchwepheshe obuqhamukayo bokupakisha obunjenge-Chip, uhlelo lwe-Chip, uhlelo lwe-Chip, i-System-In-Packal, Packal FAN. Izakhiwo ezenziwayo kanye nokusebenza okuhle kakhulu kwe-Foil yeCopper kudlala indima ebalulekile ekuthuthukiseni ukuthembeka, ukusebenza, kanye nokusebenza kwezindleko zokufakwa kwezindleko.