Izicelo ze-Copper Foil ku-Chip Packaging

I-copper foiliya ngokuya ibaluleke kakhulu ekufakweni kwe-chip ngenxa yokuguquguquka kwayo kagesi, ukuqhutshwa kwe-thermal, ukucutshungulwa, kanye nokusebenza kahle kwezindleko. Nakhu ukuhlaziya okuningiliziwe kwezinhlelo zakho zokusebenza ezithile ekufakweni kwe-chip:

1. I-Copper Wire Bonding

• Ukushintshwa Kwegolide noma Intambo Ye-Aluminium: Ngokwesiko, izintambo zegolide noma ze-aluminiyamu bezisetshenziswa ekufakweni kwe-chip ukuxhuma ngogesi ukujikeleza kwangaphakathi kwe-chip kumkhondo wangaphandle. Kodwa-ke, ngokuthuthuka kobuchwepheshe bokucubungula ithusi kanye nokucatshangelwa kwezindleko, ucwecwe lwethusi nocingo lwethusi kancane kancane kuba yizinketho ezijwayelekile. I-Copper's conductivity kagesi ilinganiselwa ku-85-95% yegolide, kodwa izindleko zayo cishe ziyingxenye eyodwa kweshumi, okuyenza ibe ukukhetha okuhle kokusebenza okuphezulu nokusebenza kahle kwezomnotho.
• Ukusebenza Kagesi Okuthuthukisiwe: I-Copper wire bonding inikeza ukumelana okuphansi kanye nokusebenza okungcono kwe-thermal ku-high-frequency kanye nezinhlelo zokusebenza zamanje, kunciphisa ngokuphumelelayo ukulahlekelwa kwamandla ekuxhumaneni kwe-chip nokuthuthukisa ukusebenza kukagesi jikelele. Ngakho-ke, ukusebenzisa i-foil yethusi njengento eqhubayo ezinkambisweni zokubopha kungathuthukisa ukusebenza kahle kokupakisha nokuthembeka ngaphandle kokukhuphula izindleko.
• Isetshenziswa kuma-Electrodes nama-Micro-Bumps: Ekuphakhenisweni kwe-flip-chip, i-chip iyaphetshwa ukuze amaphedi okokufaka/okukhiphayo (I/O) endaweni yawo axhumeke ngokuqondile kumjikelezo ku-substrate yephakheji. I-foil yethusi isetshenziselwa ukwenza ama-electrode nama-micro-bumps, athengiswa ngokuqondile ku-substrate. Ukumelana okushisayo okuphansi kanye nokuhamba okuphezulu kwethusi kuqinisekisa ukuhanjiswa okuphumelelayo kwezimpawu namandla.
• Ukwethenjelwa kanye Nokuphathwa Okushisayo: Ngenxa yokumelana kwayo okuhle nokufuduka kwe-electromigration namandla emishini, ithusi linikeza ukwethembeka okungcono kwesikhathi eside ngaphansi kwemijikelezo yokushisa ehlukahlukene kanye nokuminyana kwamanje. Ukwengeza, izinga eliphezulu lethusi le-thermal conductivity lisiza ukususa ngokushesha ukushisa okukhiqizwa ngesikhathi sokusebenza kwe-chip ku-substrate noma usinki wokushisa, okuthuthukisa amandla okuphatha okushisayo ephakheji.
• I-Lead Frame Material: I-copper foilisetshenziswa kakhulu ekufakweni kozimele okuholayo, ikakhulukazi ekufakweni kwedivayisi yamandla. Uhlaka oluholayo lunikeza ukwesekwa kwesakhiwo kanye nokuxhumeka kukagesi ku-chip, okudinga izinto ezinokusebenza okuphezulu kanye nokuhamba kahle kwe-thermal. I-foil yethusi ihlangabezana nalezi zidingo, inciphisa ngokuphumelelayo izindleko zokupakisha ngenkathi ithuthukisa ukuchithwa kokushisa nokusebenza kukagesi.
• Amasu Okwelapha Angaphezulu: Ekusetshenzisweni okungokoqobo, i-copper foil ivamise ukwelashwa phezulu njenge-nickel, ithini, noma i-silver plating ukuze kuvinjelwe i-oxidation futhi kuthuthukiswe ukubola. Lezi zindlela zokwelapha zithuthukisa futhi ukuqina nokuthembeka kwe-foil yethusi ekufakweni kohlaka lomthofu.
• I-Conductive Material kuma-Multi-Chip Module: Ubuchwepheshe besistimu ngaphakathi kwephakheji buhlanganisa ama-chips amaningi kanye nezingxenye ze-passive zibe iphakheji elilodwa ukuze kuzuzwe ukuhlanganiswa okuphezulu nokuminyana kokusebenza. I-foil yethusi isetshenziselwa ukwakha amasekethe axhumayo angaphakathi futhi asebenze njengendlela yokuqhuba yamanje. Lolu hlelo lokusebenza ludinga ucwecwe lwethusi ukuze lube ne-conductivity ephezulu nezici ezizacile kakhulu ukuze kuzuzwe ukusebenza okuphezulu endaweni yokupakisha elinganiselwe.
• Izicelo ze-RF kanye ne-Millimeter-Wave: I-copper foil iphinde idlale indima ebalulekile kumasekhethi okudlulisa amasignali amaza aphezulu ku-SiP, ikakhulukazi kumafrikhwensi omsakazo (RF) kanye nezinhlelo zokusebenza zamagagasi amamilimitha. Izici zayo eziphansi zokulahlekelwa kanye nokusebenza okuhle kakhulu kuvumela ukuba kuncishiswe ukuncishiswa kwesignali ngempumelelo futhi kuthuthukise ukusebenza kahle kokudlulisela kulezi zinhlelo zokusebenza ze-high-frequency.
• Isetshenziswa Kuzendlalelo Zokusabalalisa (RDL): Ekupakishweni kwe-fan-out, i-copper foil isetshenziselwa ukwakha isendlalelo sokusabalalisa kabusha, ubuchwepheshe obusabalalisa kabusha i-chip I/O endaweni enkulu. I-conductivity ephezulu kanye nokunamathela okuhle kwe-foil yethusi kuyenza ibe yinto ekahle yokwakha izendlalelo zokusabalalisa kabusha, ukwandisa ukuminyana kwe-I/O nokusekela ukuhlanganiswa kwama-chip amaningi.
• Ukunciphisa Usayizi kanye Nobuqotho Besiginali: Ukusetshenziswa kwe-copper foil ezendlalelo zokusabalalisa kabusha kusiza ukunciphisa usayizi wephakheji ngenkathi kuthuthukiswa ubuqotho bokudlulisa isignali nesivinini, okubaluleke kakhulu kumadivayisi eselula kanye nezinhlelo zokusebenza zekhompuyutha ezisebenza kahle ezidinga osayizi abancane bokupakisha nokusebenza okuphezulu.
• I-Copper Foil Heat Sinks kanye neziteshi ezishisayo: Ngenxa ye-thermal conductivity enhle kakhulu, i-foil yethusi ivame ukusetshenziswa kumasinki okushisa, iziteshi ezishisayo, nezinto zokusebenzisana ezishisayo ngaphakathi kokupakishwa kwe-chip ukusiza ukudlulisa ukushisa okukhiqizwa yi-chip ezakhiweni zokupholisa zangaphandle. Lolu hlelo lokusebenza lubaluleke kakhulu kuma-chips anamandla amakhulu namaphakheji adinga ukulawula izinga lokushisa okunembile, njengama-CPU, ama-GPU, nama-chips okuphatha amandla.
• Isetshenziswa ku-Through-Silicon Via (TSV) Technology: Kubuchwepheshe bokupakisha be-chip ye-2.5D ne-3D, i-copper foil isetshenziselwa ukwakha impahla yokugcwalisa eqhutshwayo ye-pass-silicon vias, ehlinzeka ukuxhumana okuqondile phakathi kwama-chips. I-conductivity ephezulu kanye nokucutshungulwa kwe-foil yethusi kuyenza ibe into ethandwayo kulobu buchwepheshe bokupakisha obuthuthukisiwe, obusekela ukuminyana okuphezulu kanye nezindlela zesignali ezimfushane, ngaleyo ndlela kuthuthukise ukusebenza kwesistimu iyonke.

2. I-Flip-Chip Packaging

3. Ukupakisha kozimele okuhola

4. I-System-in-Package (SiP)

5. I-Fan-Out Packaging

6. Izicelo Zokulawula Ukushisa Nokushisa

7. I-Advanced Packaging Technologies (efana ne-2.5D ne-3D Packaging)

Sekukonke, ukusetshenziswa kwe-copper foil ekufakweni kwe-chip akukhawulelwe ekuxhumekeni okujwayelekile kwe-thermal kodwa kudlulela kubuchwepheshe bokupakisha obuvelayo obufana ne-flip-chip, i-system-in-package, i-fan-out packaging, kanye nokupakishwa kwe-3D. Izakhiwo zemisebenzi eminingi kanye nokusebenza okuhle kakhulu kwe-copper foil kudlala indima ebalulekile ekuthuthukiseni ukwethembeka, ukusebenza, kanye nempumelelo yezindleko zokupakishwa kwe-chip.