Ukusetshenziswa kwe-Copper Foil ekupakisheni ama-Chip

Ifoyili yethusiIba yinto ebaluleke kakhulu ekupakisheni ama-chip ngenxa yokuqhuba kwawo kagesi, ukuqhuba kokushisa, ukucutshungulwa kalula, kanye nokusebenza kahle kwezindleko. Nasi ukuhlaziywa okuningiliziwe kwezicelo zayo ezithile ekupakisheni ama-chip:

1. Ukubopha Intambo Yethusi

• Ukushintshwa Kwentambo Yegolide noma Ye-Aluminium: Ngokwesiko, izintambo zegolide noma ze-aluminium bezisetshenziswa ekupakisheni ama-chip ukuze kuxhunywe ngogesi i-circuitry yangaphakathi ye-chip kuma-lead angaphandle. Kodwa-ke, ngentuthuko kwezobuchwepheshe bokucubungula ithusi kanye nokucabangela izindleko, i-foil yethusi kanye nentambo yethusi kancane kancane ziba izinketho ezivamile. Ukuqhuba kukagesi kwe-Copper cishe kungama-85-95% kunegolide, kodwa izindleko zayo cishe ziyingxenye eyodwa kweziyishumi, okwenza kube ukukhetha okuhle kokusebenza okuphezulu kanye nokusebenza kahle kwezomnotho.
• Ukusebenza Okuthuthukisiwe Kukagesi: Ukubopha ucingo lwethusi kunikeza ukumelana okuphansi kanye nokuqhuba okungcono kokushisa ekusetshenzisweni kwemvamisa ephezulu kanye nokushisa okuphezulu, kunciphisa ngempumelelo ukulahlekelwa kwamandla ekuxhumekeni kwama-chip kanye nokuthuthukisa ukusebenza kukagesi jikelele. Ngakho-ke, ukusebenzisa i-copper foil njengento eqhubayo ezinqubweni zokubopha kungathuthukisa ukusebenza kahle kokupakisha kanye nokuthembeka ngaphandle kokukhulisa izindleko.
• Kusetshenziswa kuma-Electrode nama-Micro-Bumps: Ekupakisheni kwe-flip-chip, i-chip iyaphendulwa ukuze ama-input/output (I/O) pads ebusweni bayo axhunywe ngqo kwisekethe engaphansi kwephakeji. I-Copper foil isetshenziselwa ukwenza ama-electrode nama-micro-bumps, ahlanganiswe ngqo ne-substrate. Ukumelana okuphansi kokushisa kanye nokuqhuba okuphezulu kwethusi kuqinisekisa ukudluliselwa okuphumelelayo kwezimpawu namandla.
• Ukuthembeka kanye nokuphathwa kokushisa: Ngenxa yokumelana kwayo okuhle nokufuduka kwe-electro kanye namandla omshini, ithusi linikeza ukuthembeka okungcono kwesikhathi eside ngaphansi kwemijikelezo yokushisa ehlukahlukene kanye nobuningi bamanje. Ngaphezu kwalokho, ukuhanjiswa okuphezulu kokushisa kwethusi kusiza ukusabalalisa ngokushesha ukushisa okukhiqizwa ngesikhathi sokusebenza kwe-chip kuya ku-substrate noma ku-heat sink, okuthuthukisa amakhono okuphatha ukushisa kwephakheji.
• Izinto Zohlaka Lokuhola: Ifoyili yethusiIsetshenziswa kabanzi ekupakisheni uhlaka lwe-lead, ikakhulukazi ekupakisheni idivayisi yamandla. Uhlaka lwe-lead luhlinzeka ngokusekelwa kwesakhiwo kanye nokuxhumeka kukagesi kwe-chip, okudinga izinto ezinomoya ophezulu kanye nomoya omuhle wokushisa. I-foil yethusi ihlangabezana nalezi zidingo, inciphisa ngempumelelo izindleko zokupakisha ngenkathi ithuthukisa ukusatshalaliswa kokushisa kanye nokusebenza kukagesi.
• Amasu Okwelapha Okungaphezulu: Ezisetshenzisweni ezisebenzayo, i-copper foil ivame ukuphathwa ebusweni njenge-nickel, i-tin, noma i-silver plating ukuvimbela i-oxidation nokuthuthukisa ukunamathela kwayo. Lokhu kwelashwa kuthuthukisa ukuqina nokuthembeka kwe-copper foil ekupakishweni kohlaka lwe-lead.
• Izinto Eziqhubayo Kumamojula Ama-Multi-Chip: Ubuchwepheshe besistimu ephaketheni buhlanganisa ama-chip amaningi kanye nezingxenye ezingasebenzi ephaketheni elilodwa ukuze kufezwe ukuhlanganiswa okuphezulu kanye nobuningi obusebenzayo. I-Copper foil isetshenziselwa ukukhiqiza amasekethe axhumanisayo angaphakathi futhi isebenza njengendlela yokuqhuba yamanje. Lolu hlelo lokusebenza ludinga i-copper foil ukuthi ibe nokuqhuba okuphezulu kanye nezici ezincane kakhulu ukuze kufezwe ukusebenza okuphezulu endaweni elinganiselwe yokupakisha.
• Izicelo ze-RF kanye ne-Millimeter-Wave: I-foil yethusi idlala indima ebalulekile kumasekethe okudlulisa isignali evama kakhulu ku-SiP, ikakhulukazi ekusetshenzisweni kwemvamisa yomsakazo (RF) kanye ne-millimeter-wave. Izici zayo zokulahlekelwa okuphansi kanye nokuqhuba kwayo okuhle kakhulu kuvumela ukuthi kuncishiswe ukuncishiswa kwesignali ngempumelelo futhi kuthuthukiswe ukusebenza kahle kokudlulisa kulezi zinhlelo zokusebenza zemvamisa ephezulu.
• Kusetshenziswa Ezingqimbeni Zokusabalalisa Kabusha (RDL): Ekupakisheni okukhipha uphethiloli, i-foil yethusi isetshenziswa ukwakha ungqimba lokusabalalisa kabusha, ubuchwepheshe obusabalalisa kabusha i-chip I/O endaweni enkulu. Ukushisa okuphezulu kanye nokunamathela okuhle kwe-foil yethusi kwenza kube yinto efanelekile yokwakha ungqimba lokusabalalisa kabusha, okwandisa ubuningi be-I/O kanye nokusekela ukuhlanganiswa kwama-chip amaningi.
• Ukunciphisa Usayizi kanye Nobuqotho Besignali: Ukusetshenziswa kwe-copper foil ezingqimbeni zokusabalalisa kabusha kusiza ukunciphisa usayizi wephakheji ngenkathi kuthuthukiswa ubuqotho bokudluliselwa kwesignali kanye nesivinini, okubaluleke kakhulu kumadivayisi eselula kanye nezinhlelo zokusebenza zekhompyutha ezisebenza kahle ezidinga osayizi abancane bokupakisha kanye nokusebenza okuphezulu.
• Izinki Zokushisa Ze-Copper Foil Neziteshi Zokushisa: Ngenxa yokuguquguquka kwayo okuhle kakhulu kokushisa, i-copper foil ivame ukusetshenziswa kuma-heat sinks, iziteshi zokushisa, kanye nezinto zokusetshenziswa kwe-thermal ngaphakathi kokupakisha ama-chip ukusiza ukudlulisa ngokushesha ukushisa okukhiqizwa yi-chip kuya ezakhiweni zokupholisa zangaphandle. Lolu hlelo lokusebenza lubaluleke kakhulu kuma-chip anamandla amakhulu namaphakeji adinga ukulawulwa kokushisa okunembile, njenge-CPU, ama-GPU, kanye nama-chip okuphatha amandla.
• Kusetshenziswa kubuchwepheshe be-Through-Silicon Via (TSV): Kubuchwepheshe bokupakisha ama-chip angu-2.5D kanye no-3D, i-copper foil isetshenziselwa ukudala izinto zokugcwalisa ezisebenzisa ugesi ze-through-silicon vias, okuhlinzeka ngokuxhumana okuqondile phakathi kwama-chip. Ukuqhuba okuphezulu kanye nokucutshungulwa kwe-copper foil kwenza kube yinto ekhethwayo kulezi zobuchwepheshe zokupakisha ezithuthukisiwe, okusekela ukuhlanganiswa okuphezulu kobuningi kanye nezindlela ezimfushane zesignali, ngaleyo ndlela kuthuthukisa ukusebenza kwesistimu iyonke.

2. Ukupakishwa kwe-Flip-Chip

3. Ukupakisha Uhlaka Lokuhola

4. I-System-in-Package (i-SiP)

5. Ukupakishwa kwe-Fan-Out

6. Ukuphathwa Kokushisa kanye Nezicelo Zokushabalalisa Ukushisa

7. Ubuchwepheshe Bokupakisha Obuthuthukisiwe (njengokupakisha okungu-2.5D no-3D)

Sekukonke, ukusetshenziswa kwe-copper foil ekupakisheni ama-chip akugcini nje ekuxhumaneni okuvamile okuhambisa umoya kanye nokuphathwa kokushisa kodwa kudlulela nakubuchwepheshe obusha bokupakisha njenge-flip-chip, i-system-in-package, i-fan-out packaging, kanye ne-3D packaging. Izakhiwo eziningi zokusebenza kanye nokusebenza okuhle kakhulu kwe-copper foil kudlala indima ebalulekile ekuthuthukiseni ukuthembeka, ukusebenza, kanye nokusebenza kahle kwezindleko zokupakisha ama-chip.