I-tin plating ihlinzeka "ngesikhali sensimbi esiqinile" sayoucwecwe lwethusi, efinyelela ibhalansi ephelele phakathi kokuthengiselana, ukumelana nokugqwala, kanye nokusebenza kahle kwezindleko. Lesi sihloko sichaza ukuthi ucwecwe lwe-tin-plated copper lube kanjani into esemqoka kumthengi kanye nogesi wezimoto. Igqamisa izindlela ezibalulekile zokuhlanganisa i-athomu, izinqubo ezintsha, nezinhlelo zokusebenza zokusetshenziswa kokugcina, ngenkathi ihlola.I-CIVEN METALIntuthuko kubuchwepheshe bokufaka ithini.
1. Izinzuzo Ezintathu Eziyinhloko Zokucwenga Tin
1.1 I-Quantum Leap in Soldering Performance
Ungqimba lukathayela (oluzungeze u-2.0μm ubukhulu) luguqula ukudayiswa ngezindlela ezimbalwa:
- I-Lower-Temperature Soldering: Ithini liyancibilika ku-231.9°C, linciphisa izinga lokushisa lisuka ku-850°C lethusi liye ku-250–300°C nje.
- Ukumanzisa Okuthuthukisiwe: Ukuqina kwe-tin ebusweni kwehla ukusuka ku-1.3N/m kuya ku-0.5N/m, okwandisa indawo yokusabalalisa i-solder ngo-80%.
- Ama-IMC Alungiselelwe (I-Intermetallic Compounds): Isendlalelo se-Cu₆Sn₅/Cu₃Sn segradient sinyusa amandla okushear abe ngu-45MPa (i-soldering yethusi engenalutho ifinyelela ku-28MPa kuphela).
1.2 Ukumelana Nokugqwala: “Isithiyo Esinamandla”
| I-Corrosion Scenario | Isikhathi Sokuhluleka Kwethusi Elingenalutho | Isikhathi Sokuhluleka Kwe-Tin-Plated Copper | Isici Sokuvikela |
| Umkhathi Wezimboni | Izinyanga eziyisi-6 (ukugqwala okuluhlaza) | Iminyaka engu-5 (ukulahlekelwa isisindo <2%) | 10x |
| I-Sweat Corrosion (pH=5) | Amahora angama-72 (ukubhobozwa) | Amahora angu-1,500 (akukho monakalo) | 20x |
| I-Hydrogen sulfide Corrosion | Amahora angu-48 (amnyama) | Amahora angu-800 (akukho ukuguquguquka) | 16x |
1.3 Ukusebenza: Isu “Lokuzinikela Okuncane”
- Ukumelana nogesi kukhuphuka kancane kuphela, ngo-12% (1.72×10⁻⁸ kuya ku-1.93×10⁻⁸ Ω·m).
- Umphumela wesikhumba uyathuthuka: Ku-10GHz, ukujula kwesikhumba kuyenyuka kusuka ku-0.66μm kuya ku-0.72μm, okuholela ekulahlekelweni kokufakwa okungu-0.02dB/cm nje.
2. Lungiselela Izinselele: “Ukusika vs. Plating”
2.1 Ukucwenga Okugcwele (Ukusika Ngaphambi Kokubala)
- Izinzuzo: Imiphetho imbozwe ngokuphelele, ayinakho ithusi eliveziwe.
- Izinselele zobuchwepheshe:
- Amabhula kufanele alawulwe ngaphansi kuka-5μm (izinqubo zendabuko zidlula i-15μm).
- Isixazululo sokucwenga kufanele singene ngaphezu kwama-50μm ukuze kuqinisekiswe ukumbozwa komphetho okufanayo.
2.2 Ukucwenga Kwangemuva Kokusikwa (Plating Ngaphambi Kokusika)
- Izinzuzo Zezindleko: Kwenyusa ukusebenza kahle kokucubungula ngo-30%.
- Izinkinga Ezibucayi:
- Imiphetho yethusi eveziwe isukela ku-100–200μm.
- Ukuphila kokufuthwa kukasawoti kuncishiswe ngo-40% (kusuka emahoreni ayi-2,000 kuye kwayi-1,200).
2.3I-CIVEN METALIndlela ka-“Zero-Defect”
Ukuhlanganisa ukusika ngokunemba kwe-laser ne-pulse tin plating:
- Ukunemba Ukusika: Amabhula agcinwe ngaphansi kuka-2μm (Ra=0.1μm).
- I-Edge Coverage: Ukujiya kwe-Side Plating ≥0.3μm.
- Izindleko-Ngempumelelo: Ibiza ngo-18% ngaphansi kunezindlela zokucwenga ezigcwele zendabuko.
3. I-CIVEN METALI-Tin-PlatedI-Copper Foil: Umshado Wesayensi Nobuhle
3.1 Ukulawula Okunembayo Kwe-Coating Morphology
| Thayipha | Amapharamitha okucubungula | Izici Ezibalulekile |
| Ithini Elikhanyayo | Ukuminyana kwamanje: 2A/dm², okungeziwe A-2036 | Ukubukeka >85%, Ra=0.05μm |
| Matte Tin | Ukuminyana kwamanje: 0.8A/dm², azikho izithasiselo | Ukubona <30%, Ra=0.8μm |
3.2 Amamethrikhi Okusebenza Okuphakeme
| Imethrikhi | Isilinganiso Semboni |I-CIVEN METALI-Tin-Plated Copper | Ukuthuthukiswa |
| Ukuchezuka Kokuqina Kokujiya (%) | ±20 | ±5 | -75% |
| I-Solder Void Rate (%) | 8–12 | ≤3 | -67% |
| Bend Resistance (imijikelezo) | 500 (R=1mm) | 1,500 | + 200% |
| Ukukhula Kwe-Tin Whisker (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 Izindawo Ezibalulekile Zokufaka Isicelo
- Ama-FPC ama-Smartphone: I-Matte tin (ubukhulu obungu-0.8μm) iqinisekisa ukudayiswa okuzinzile kwe-30μm umugqa / isikhala.
- I-ECU yezimoto: Ithini elikhanyayo limelana nemijikelezo yokushisa engu-3,000 (-40°C↔+125°C) ngaphandle kokuhluleka kokuhlangana kwe-solder.
- Photovoltaic Junction Amabhokisi: Ukufakwa kwe-tin ezinhlangothini ezimbili (1.2μm) kufinyelela ukumelana nokuxhumana <0.5mΩ, kukhulisa ukusebenza kahle ngo-0.3%.
4. Ikusasa Le-Tin Plating
4.1 I-Nano-Composite Coatings
Ukuthuthukisa i-Sn-Bi-Ag ternary alloy coatings:
- Indawo encibilikayo ephansi ibe ngu-138°C (ilungele ama-electronics aguquguqukayo asezingeni eliphansi).
- Ithuthukisa ukumelana ne-creep ngo-3x (ngaphezu kwamahora angu-10,000 ku-125 ° C).
4.2 Uguquko Lokufakwa Kwe-Tin Okuhlaza
- Izixazululo Ezingenayo I-Cyanide: Yehlisa i-COD yamanzi angcolile isuka ku-5,000mg/L iye ku-50mg/L.
- Izinga Lokutholwa Kwethayela Eliphezulu: Ngaphezu kuka-99.9%, inqubo yokusika ibiza ngama-25%.
I-tin Plating iyashintshaucwecwe lwethusiisuka ku-conductor eyisisekelo iye “entweni yesixhumi esibonakalayo esihlakaniphile.”I-CIVEN METALUkulawulwa kwenqubo yeleveli ye-athomu kuphusha ukwethembeka nokuqina kwemvelo kwefoyili yethusi efakwe ithayela ezindaweni eziphakeme. Njengoba ama-electronics abathengi ancipha futhi ama-electronics ezimoto adinga ukwethembeka okuphezulu,i-tin-plated yethusi ucwecweiba yisisekelo senguquko yokuxhumana.
Isikhathi sokuthumela: May-14-2025