Ukuphambukisa kuyinqubo ebalulekile ekukhiqizeni okugoqiweI-Copper Foil. Isebenza njenge- "Molecular-Level Shield" ebusweni, ithuthukisa ukumelana nokugqwala ngenkathi ilinganisa umthelela wayo ngokucophelela ngezakhiwo ezibucayi njengokuphakelayo kanye nokuzenzisa. Le ndatshana idlulela kwisayensi ngemuva kwezindlela zokuphambanisa, ukuhweba okusebenzayo, kanye nemikhuba yobunjiniyela. UkusebenzisaI-CENERNAL MeTALI-Breakthroughs Preakiegs njengesibonelo, sizohlola inani layo elihlukile ekukhiqizweni kwe-elekthronikhi ephezulu.
1. Ukuphumelela: "Isihlangu se-Molecular-Level" ye-Foil Foil
1.1 Ukuthi Ungqimba Wezikhathi Zokuhamba
Ngokusebenzisa izindlela zokwelapha zamakhemikhali noma ze-electrochemical, i-compact oxide ungqimba 10-50nm amafomu agqinsi amnyama ebusweni beI-Copper Foil. Iqanjwe ikakhulukazi ye-cu₂o, i-cuo, kanye nezakhiwo ze-organic, lolu handla luhlinzeka:
- Izithiyo ezibonakalayo:I-coffience ye-oksijini ye-oksijini iyancipha kuya ku-1 × 10⁻¹⁴ cm / s (phansi kusuka ku-5 × 10⁻⁸ cm / s ye-arepre yethu yethusi).
- Ukuphumelela kwe-Electrochemical:Ukugqwala kwamahlathi kwamanje kwama-density kusuka ku-10μ / cm² kuye ku-0.1μ / cm².
- Ukungena kwamakhemikhali:Amandla wamahhala angaphezulu ancishisiwe kusuka ku-72mj / M² kuya ku-35MJ / M², acindezele ukuziphatha okusebenzayo.
1.2 Izinzuzo ezinhlanu ezibalulekile zokuphumelela
| Isici sokusebenza | I-Foil Foil Engalawulwa | I-Foil Foil Yaseduze | Ukululama |
| Ukuhlolwa kosawoti (amahora) | (Izindawo zokugqwala ezibonakalayo) | 500 (akukho ukugqwala okubonakalayo) | + 1983% |
| I-oxidation ephezulu yokushisa (150 ° C) | Amahora ama-2 (aphenduka abe mnyama) | Amahora angama-48 (agcina umbala) | + 2300% |
| Impilo Yokugcina | Izinyanga ezi-3 (i-vacuum-phama) | Izinyanga eziyi-18 (ezijwayelekile ezigcwele) | + 500% |
| Ukumelana Nokuxhumana (Mω) | 0.25 | 0.26 (+ 4%) | - |
| Ukulahleka kokufakwa imvamisa okuphezulu (10GHz) | 0.15db / cm | I-0.16DB / cm (+ 6.7%) | - |
2. "Inkemba esika nhlangothi zonke" yezendlalelo zokuhamba - nokuthi ungayilinganisa kanjani
2.1 Ukuhlola ubungozi
- Ukuncishiswa okuncane kokuphakelayo:Isendlalelo sokuhamba sandisa ukujula kwesikhumba (ku-10GHz) kusuka ku-0.66μm kuya ku-0.62μm, kepha ngokugcina ukushuba ngaphansi kwe-30nm, ukumelana nokumelana kungakhawulelwa ngaphansi kuka-5%.
- Izinselelo Zokuthengisa:Amandla aphansi angaphansi akhulisa ama-angles womthengisi asuka ku-15 ° kuya ku-25 °. Kusetshenziswa ama-pastes asebenzayo we-soles (uhlobo lwe-RA) angasusa lo mphumela.
- Izinkinga zokunamathela:Amandla e-Resin ahlanganisa amandla angahle wehlise i-10-15%, engancishiswa ngokuhlanganisa izinqubo zokuncintisana nezinqubo zokuhamba.
2.2I-CENERNAL MeTALIndlela yokulinganisa
Ubuchwepheshe Bokuqhamuka Kwe-Phatha
- Ungqimba lwesisekelo:Ukukhula kwe-electrochemical kwe-5NM CU₂O nge (111) okuthandwayo.
- Ungqimba oluphakathi:Ifilimu engu-2-3nm benzotriazole (Bta) siqoqe ifilimu.
- Ungqimba wangaphandle:I-Agent ehlanganayo ye-Silane (Izinqubo) zokuthuthukisa ukunamathela kwe-resin.
Imiphumela Yokusebenza Elungiselelwe:
| Metric | Izidingo ze-IPC-4562 | I-CENERNAL MeTALImiphumela ye-foil yethuli |
| Ukumelana Nobubanzi (mω / sq) | ≤300 | 220-250 |
| Amandla we-Peel (N / cm) | ≥0.8 | 1.2-1.5 |
| I-Soler Jonsile Tensile Amandla (MPA) | ≥25 | 28-32 |
| I-Ionic Migration Rate (μg / cm²) | ≤0.5 | 0.2-0.3 |
3. I-CENERNAL MeTALUbuchwepheshe bokudlula kwe-S: Ukuchaza kabusha amazinga okuvikela
3.1 uhlelo lokuvikela ama-tier ezine
- Ukulawulwa kwe-Ultra-Thin onide:I-Pulse Anodization ifinyelela ukuhlukahluka kokuqina ngaphakathi ± 2nm.
- Izendlalelo ze-Organic-inorganic hybrid:I-Bta noSilane basebenza ngokubambisana ukunciphisa amanani entengo afinyelela ku-0.003mm / ngonyaka.
- Ukwelashwa kokusebenza komhlaba:Ukuhlanza i-Plasma Cleaning (AR / O₂ Ggesi Mix) Kubuyisela ama-angles we-solder afaka u-18 °.
- Ukuqapha real-time:I-ellipsometry iqinisekisa ukuqina kwe-warner usayizi ngaphakathi ± 0.5nm.
3.2 Ukuqinisekiswa Kwemvelo Eyedlulele
- Umswakama ophezulu nokushisa:Ngemuva kwamahora ayi-1 000 ku-85 ° C / 85% RH, izinguquko zokumelana komhlaba ezingaphansi kuka-3%.
- Ukushaqeka kwe-Thermal:Ngemuva kwemijikelezo engama-200 ka -55 ° C kuya ku- + 125 ° C, akukho ukuqhekeka okuvela ku-waprivation ungqimba (kuqinisekiswe yi-SEM).
- Ukumelana Kwamakhemikhali:Ukumelana no-10% VCL VAPOR kukhuphuka kusuka emizuzwini emi-5 kuya kwemizuzu engama-30.
3.3 ukuhambisana kuzo zonke izinhlelo zokusebenza
- 5G millimeter-wave antennas:Ukulahleka kokufakwa kwe-28hzz kuncishiswe ku-0,17DB / cm (kuqhathaniswa nabancintisana nabo '0.21DB / CM).
- Izithuthi ze-elekthronikhi:Idlula i-ISO 16750-4 izivivinyo zikasawoti zokufafaza, ngemijikelezo eyengeziwe kuya ku-100.
- IC substrates:Amandla okunamathela nge-ABF Resin afinyelela ku-1.8N / CM (isilinganiso embonini: 1.2N / CM).
4. Ikusasa lobuchwepheshe bokuphambuka
4.1 I-Atomic Layer Deposition (ALD) Technology
Ukuthuthukisa amafilimu we-Nano
- Ubukhulu:<5nm, ngokuqiniseka kwandise ≤1%.
- Ukumelana Ne-Anodic Game):Ukuthuthuka kwe-5x.
4.2 izingqimba zokuzenzela ukuzilapha
Ukufaka ama-corocappule corrosion inhibitors (benzimidazole derivatives):
- Ukusebenza kahle kokuzenzisa:Ngaphezulu kwama-90% kungakapheli amahora angama-24 ngemuva kokuhlwitha.
- Impilo Yenkonzo:Kunwetshwe iminyaka engama-20 (kuqhathaniswa neminyaka eyi-10-16 ejwayelekile).
Isiphetho:
Ukwelashwa kokuphambuka kufinyelela ibhalansi ecwengekile phakathi kokuvikelwa nokusebenza kwe-rolledI-Copper Foil. Ngokusebenzisana,I-CENERNAL MeTALInciphisa ukwehla kwephasivu, ukuyiguqula ibe "yizempi ezingabonakali" kuqinisa ukuthembeka komkhiqizo. Njengoba imboni ye-elekthronikhi iqhubekela phambili ngobuningi obuphezulu kanye nokwethembeka, ukuphumelela okunembile nokulawulwa sekuyitshe le-foil foil.
Isikhathi sePosi: Mar-03-2025