I-passivation iyinqubo ewumnyombo ekukhiqizeni i-rolleducwecwe lwethusi. Isebenza "njengesihlangu seleveli yamangqamuzana" ngaphezulu, ithuthukisa ukumelana nokugqwala ngenkathi ilinganisa ngokucophelela umthelela wayo ezimpahleni ezibucayi ezifana ne-conductivity kanye ne-solderability. Le ndatshana icubungula isayensi engemuva kwezindlela zokudlula, ukuhwebelana kokusebenza, kanye nezinqubo zobunjiniyela. UkusebenzisaI-CIVEN METALimpumelelo njengesibonelo, sizohlola inani layo eliyingqayizivele ekukhiqizeni izinto zikagesi ezisezingeni eliphezulu.
1. I-Passivation: “Isihlangu Sezinga Le-Molecular” Yecwecwe Lethusi
1.1 Indlela Ungqimba Lwe-Passivation olwakha ngayo
Ngokwelashwa ngamakhemikhali noma nge-electrochemical, ungqimba oluyi-compact oxide oluyi-10-50nm lwamafomu angaphezuluucwecwe lwethusi. Yakhiwe ikakhulukazi i-Cu₂O, i-CuO, ne-organic complexes, lesi sendlalelo sihlinzeka:
- Izithiyo Ezingokomzimba:I-coefficient yokusabalalisa komoyampilo yehla ibe ngu-1×10⁻¹⁴ cm²/s (phansi isuka ku-5×10⁻⁸ cm²/s ngethusi elingenalutho).
- I-Electrochemical Passivation:Ukuminyana kwamanje kokubola kwehla kusuka ku-10μA/cm² kuya ku-0.1μA/cm².
- Ukungena Kwamakhemikhali:Amandla amahhala angaphezulu ancishiswa ukusuka ku-72mJ/m² ukuya ku-35mJ/m², okucindezela ukuziphatha okusebenzayo.
1.2 Izinzuzo Ezinhlanu Ezibalulekile Zokudlula
| Isici sokuSebenza | I-Copper Foil Engaphekiwe | I-Pasivated Copper Foil | Ukuthuthukiswa |
| Ukuhlolwa kwesifutho sikasawoti (amahora) | 24 (izindawo zokugqwala ezibonakalayo) | 500 (akukho ukugqwala okubonakalayo) | + 1983% |
| I-High-Temperature Oxidation (150°C) | Amahora angu-2 (iphenduka ibe mnyama) | Amahora angu-48 (igcina umbala) | + 2300% |
| Ukuphila Kwesitoreji | Izinyanga ezi-3 (i-vacuum-packed) | Izinyanga eziyi-18 (okujwayelekile kupakishwe) | +500% |
| Ukumelana Nokuxhumana (mΩ) | 0.25 | 0.26 (+4%) | - |
| Ukulahlekelwa Kokufaka Imvamisa Ephezulu (10GHz) | 0.15dB/cm | 0.16dB/cm (+6.7%) | - |
2. “Inkemba Esika-Mbili” Yezendlalelo Zokudlula—Nendlela Yokulinganisa Ngayo
2.1 Ukuhlola Ubungozi
- Ukwehliswa Kancane Kokuziphatha:I-passivation layer inyusa ukujula kwesikhumba (ku-10GHz) isuka ku-0.66μm iye ku-0.72μm, kodwa ngokugcina ukushuba ngaphansi kuka-30nm, ukukhuphuka kokumelana kungakhawulelwa ngaphansi kuka-5%.
- Izinselele zokusondeza:Amandla angaphansi akhuphula ama-engeli wokumanzisa ama-solder ukusuka ku-15° ukuya ku-25°. Ukusebenzisa ama-solder pastes asebenzayo (uhlobo lwe-RA) kungasusa lo mphumela.
- Izinkinga zokunamathela:Amandla okubopha inhlaka angase ehle ngo-10-15%, angancishiswa ngokuhlanganisa izinqubo zokuqina kanye nezokudlula.
2.2I-CIVEN METALIndlela yokulinganisa ka-'s
I-Gradient Passivation Technology:
- Isendlalelo sesisekelo:Ukukhula kwe-Electrochemical kwe-5nm Cu₂O enomumo (111) okhethwayo.
- Isendlalelo esimaphakathi:Ifilimu ezihlanganiselwe ngokwayo engu-2–3nm benzotriazole (BTA).
- Isendlalelo sangaphandle:I-Silane coupling agent (APTES) yokuthuthukisa ukunamathela kwe-resin.
Imiphumela Yokusebenza Ethuthukisiwe:
| Imethrikhi | I-IPC-4562 Izidingo | I-CIVEN METALImiphumela Ye-Copper Foil |
| Ukumelana Nobuso (mΩ/sq) | ≤300 | 220–250 |
| Amandla e-Peel (N/cm) | ≥0.8 | 1.2–1.5 |
| I-Solder Joint Tensile Strength (MPa) | ≥25 | 28–32 |
| Isilinganiso Sokuthutha se-Ionic (μg/cm²) | ≤0.5 | 0.2–0.3 |
3. I-CIVEN METAL's Passivation Technology: Ukuchaza Kabusha Amazinga Okuvikela
3.1 Uhlelo Lokuvikela olunezigaba ezine
- I-Ultra-Thin oxide Control:I-Pulse anodization ifinyelela ukuhluka kogqinsi phakathi kuka-±2nm.
- Izendlalelo ze-Organic-Inorganic Hybrid:I-BTA ne-silane zisebenza ndawonye ukuze kwehliswe amazinga okugqwala abe ngu-0.003mm/ngonyaka.
- Ukwelashwa Kokwenza Kusebenze Ubuso:Ukuhlanza i-Plasma (ingxube yegesi ye-Ar/O₂) kubuyisela ama-engeli wokumanzisa ama-solder abe ngu-18°.
- Ukuqapha Kwesikhathi Sangempela:I-Ellipsometry iqinisekisa ukushuba kongqimba lwe-passivation ngaphakathi ± 0.5nm.
3.2 Ukuqinisekiswa Kwemvelo Okudlulele
- Ukuswakama Okuphezulu Nokushisa:Ngemva kwamahora angu-1,000 ku-85°C/85% RH, ukumelana nendawo kushintsha ngaphansi kuka-3%.
- I-Thermal Shock:Ngemuva kwemijikelezo engu-200 ye--55 ° C kuya ku-+125 ° C, akukho mifantu evela kungqimba lwe-passivation (okuqinisekiswe yi-SEM).
- Ukumelana Namakhemikhali:Ukungazweli ku-10% umhwamuko we-HCl ukhuphuka usuka emizuzwini emi-5 ukuya kwengama-30.
3.3 Ukuhambisana Kuzo zonke Izicelo
- I-5G Millimeter-Wave Antennas:Ukulahlekelwa kokufaka okungu-28GHz kwehliselwe ku-0.17dB/cm kuphela (uma kuqhathaniswa no-0.21dB/cm wezimbangi).
- I-Automotive Electronics:Kudlula izivivinyo ze-ISO 16750-4 zesifutho sikasawoti, ngemijikelezo eyandisiwe iye ku-100.
- I-IC Substrates:Amandla okunamathela ane-ABF resin afinyelela ku-1.8N/cm (isilinganiso semboni: 1.2N/cm).
4. Ikusasa Lobuchwepheshe Be-Passivation
4.1 Ubuchwepheshe be-Atomic Layer Deposition (ALD).
Ukuthuthukisa amafilimu e-nanolaminate passivation asekelwe ku-Al₂O₃/TiO₂:
- Ubukhulu:<5nm, ngokumelana nokunyuka okungu-≤1%.
- I-CAF (Conductive Anodic Filament) Ukumelana:5x ukuthuthukiswa.
4.2 Izendlalelo Zokuziphilisa Zokuziphilisa
Kubandakanya ama-microcapsule corrosion inhibitors (okuphuma kubenzimidazole):
- Ukusebenza kahle kokuziphilisa:Ngaphezu kwama-90% emahoreni angama-24 ngemuva kokuklwebheka.
- Impilo Yesevisi:Inwetshwe ibe yiminyaka engama-20 (uma kuqhathaniswa neminyaka eyi-10-15 ejwayelekile).
Isiphetho:
Ukwelashwa kwe-passivation kufinyelela ibhalansi ecolisisiwe phakathi kokuvikela nokusebenza kokugoqwaucwecwe lwethusi. Ngokusungula izinto ezintsha,I-CIVEN METALinciphisa ama-passivation's downsides, iyenze ibe "izikhali ezingabonakali" ezithuthukisa ukuthembeka komkhiqizo. Njengoba imboni ye-elekthronikhi iqhubekela ekuminyaneni okuphezulu nasekuthembekeni, ukuvunyelwa okunembayo nokulawulwayo sekuyisisekelo sokwenza ucwecwe lwekhopha.
Isikhathi sokuthumela: Mar-03-2025