Ukwelashwa Kwangemva Kokwelashwa Kwe-Copper Foil: “I-Anchor Lock” Ubuchwepheshe Bokuxhumanisa Nokuhlaziywa Kwesicelo Okuphelele

Emkhakheni weucwecwe lwethusiukukhiqiza, ukwelapha kwangemva kokwelashwa kuyinqubo eyinhloko yokuvula amandla okubopha okusetshenziswayo. Lesi sihloko sihlaziya isidingo sokwelashwa okuqinile ngokwemibono emithathu: umphumela wokubambelela ngomshini, izindlela zokusebenzisa inqubo, kanye nokuvumelana nezimo kokusetshenziswa kokugcina. Iphinde ihlole inani lokusetshenziswa kwalobu buchwepheshe emikhakheni efana nokuxhumana kwe-5G namabhethri wamandla amasha, okusekelweI-CIVEN METAL's ukuphumelela kwezobuchwepheshe.

1. Ukwelashwa Okuqinile: Ukusuka “ku-Smooth Trap” kuya “ku-Anchored Interface”

1.1 Amaphutha Abulalayo Omphezulu Obushelelezi

Ubulukhuni bangempela (Ra) beucwecwe lwethusiizindawo ezingaphezulu ngokuvamile zingaphansi kuka-0.3μm, okuholela ezinkingeni ezilandelayo ngenxa yezici zayo ezifana nesibuko:

• I-Physical Bonding Enganele: Indawo yokuxhumana ene-resin ingu-60-70% kuphela yenani lethiyori.
• I-Chemical Bonding Barriers: Ungqimba oluminyene lwe-oxide (ugqinsi lwe-Cu₂O mayelana no-3-5nm) luvimbela ukuchayeka kwamaqembu asebenzayo.
• I-Thermal Stress Sensitivity: Umehluko ku-CTE (I-Coefficient of Thermal Expansion) ingabangela ukususwa kwesixhumi esibonakalayo (ΔCTE = 12ppm/°C).

1.2 Impumelelo Emithathu Ebalulekile Yezobuchwepheshe Ezinqubweni Zokuhlukumeza

Ngokwakha uhlaka olunezinhlangothi ezintathu zezinga le-micron (bona Umfanekiso 1), ungqimba oluqinile luyazuza:

• I-Mechanical Interlocking: Amafomu okungena kwe-resin afaka “i-barbed” anchoring (ukujula> 5μm).
• Ukusebenza Kwekhemikhali: Ukuveza (111) izindiza zekristalu ezinomsebenzi ophezulu kukhulisa ukuminyana kwesayithi elixhumanisa kumasayithi angu-10⁵/μm².
• I-Thermal Stress Buffering: Isakhiwo se-porous sidonsa ngaphezu kwe-60% yokucindezeleka okushisayo.
• Umzila Wokucubungula: Isixazululo se-Acidic copper plating (CuSO₄ 80g/L, H₂SO₄ 100g/L) + I-Pulse Electro-deposition (umjikelezo womsebenzi 30%, imvamisa ngu-100Hz)
• Izici Zesakhiwo:
  • Ubude be-dendrite yethusi 1.2-1.8μm, ububanzi bungu-0.5-1.2μm.
  • Okuqukethwe komoyampilo ebusweni ≤200ppm (ukuhlaziywa kwe-XPS).
  • Ukumelana nokuxhumana <0.8mΩ·cm².
• Umzila Wokucubungula: Isixazululo se-Cobalt-nickel alloy plating (Co²+ 15g/L, Ni²+ 10g/L) + I-Chemical Displacement Reaction (pH 2.5-3.0)
• Izici Zesakhiwo:
  • Usayizi wezinhlayiyana ze-CoNi ingxubevange engu-0.3-0.8μm, ukuminyana kokunqwabelana > 8×10⁴ izinhlayiya/mm².
  • Okuqukethwe komoyampilo ongaphezulu ≤150ppm.
  • Ukumelana nokuxhumana <0.5mΩ·cm².

2. I-Red Oxidation vs. Black Oxidation: Izimfihlo Zenqubo Ngemva Kwemibala

2.1 I-Red Oxidation: “Izikhali” Zethusi

2.2 I-Black Oxidation: I-alloy “Armor”

2.3 Ingqondo Yezentengiselwano Ngemva Kokukhethwa Kombala

Yize izinkomba zokusebenza ezibalulekile (ukunamathela kanye nokuhamba) kwe-oxidation ebomvu nemnyama yehluka ngaphansi kwe-10%, imakethe ikhombisa umehluko ocacile:

• Icwecwe Lethusi Le-Oxidized Ebomvu: Ibalelwa ku-60% wesheya yemakethe ngenxa yenzuzo yayo enkulu yezindleko (12 CNY/m² vs. black 18 CNY/m²).
• I-Black Oxidized Copper Foil: Ibusa imakethe esezingeni eliphezulu (ama-FPC agibele imoto, ama-millimeter-wave PCB) ngesabelo semakethe esingu-75% ngenxa:
  • Ukwehliswa okungu-15% ekulahlekeni kwe-high-frequency (Df = 0.008 vs. i-oxidation ebomvu 0.0095 ku-10GHz).
  • U-30% uthuthukise ukumelana ne-CAF (Conductive Anodic Filament).

3. I-CIVEN METAL: "I-Nano-Level Masters" ye-Roughening Technology

3.1 Ubuchwepheshe obusha “bokuRhwayela kwe-Gradient”

Ngokulawula inqubo yezigaba ezintathu,I-CIVEN METALilungiselela ukwakheka kwendawo (bheka uMdwebo 2):

1. I-Nano-Crystalline Seed Layer: Electro-deposition of cores cores 5-10nm ngosayizi, ukuminyana > 1×10¹¹ izinhlayiya/cm².
2. Ukukhula kweMicron Dendrite: I-Pulse yamanje ilawula umumo we-dendrite (ibeka kuqala isiqondiso (110)).
3. I-Surface Passivation: I-Organic silane coupling agent (APTES) inamathela ithuthukisa ukumelana ne-oxidation.

3.2 Ukusebenza Okudlula Amazinga Emboni

3.3 End-Use Applications Matrix

• I-5G Base Station PCB: Isebenzisa ucwecwe lwethusi olufakwe oksijini emnyama (Ra = 1.5μm) ukuze kuzuzwe ukulahlekelwa kokufaka okungu-<0.15dB/cm ku-28GHz.
• Iziqoqi Zebhethri Lamandla: I-oxidized ebomvuucwecwe lwethusi(amandla e-tensile 380MPa) inikeza impilo yomjikelezo > imijikelezo engu-2000 (imijikelezo engu-1500 ejwayelekile kazwelonke).
• I-Aerospace FPCs: Isendlalelo esiqinile simelana nokushaqeka okushisayo ukusuka ku -196°C kuya ku-+200°C imijikelezo engu-100 ngaphandle kokuncipha.

4. Inkundla Yempi Yesikhathi Esizayo Yocwecwe Lwethusi Oluqinile

4.1 Ubuchwepheshe Be-Ultra-Roughening

Ngezidingo zokuxhumana ze-6G terahertz, isakhiwo esinamagatshana esine-Ra = 3-5μm siyathuthukiswa:

• I-Dielectric Constant Stability: Ithuthukiswe ku-ΔDk <0.01 (1-100GHz).
• Ukumelana Nokushisa: Yehliswe ngo-40% (ithola u-15W/m·K).

4.2 Izinhlelo Ezihlakaniphile Zokushusha

Ukutholwa kombono okuhlanganisiwe kwe-AI + ukulungiswa kwenqubo eguquguqukayo:

• Ukwengamela Umkhathi Wangempela: Imvamisa yesampula amafreyimu ayi-100 ngomzuzwana.
• Ukulungiswa Kwamanje Kokuminyana Okuguquguqukayo: Ukunemba ±0.5A/dm².

I-foil yethusi eyenza ukuqina ngemva kokwelashwa iguqukile isuka “enqubweni yokuzithandela” yaya “esiphindaphindeni sokusebenza.” Ngokusebenzisa inqubo emisha kanye nokulawulwa kwekhwalithi eyeqisayo,I-CIVEN METALiphushele ubuchwepheshe obuqinile ekunembeni kweleveli ye-athomu, ihlinzekela ukwesekwa kwezinto eziyisisekelo zokuthuthukiswa kwemboni yezogesi. Ngokuzayo, emjahweni wobuchwepheshe obuhlakaniphile, obuphezulu, nobuthembeke kakhudlwana, noma ubani ophethe “ikhodi yeleveli encane” yobuchwepheshe obushaqisayo uzobusa indawo ephezulu yamasu.ucwecwe lwethusiimboni.

(Umthombo Wedatha:I-CIVEN METAL2023 Umbiko Wonyaka Wezobuchwepheshe, IPC-4562A-2020, IEC 61249-2-21)