I-Electrodeposited (ED)i-foil yethusiiyinsika engabonakali yama-elekthronikhi anamuhla. Iphrofayili yayo encane kakhulu, ukuguquguquka okuphezulu, kanye nokuqhuba kwayo okuhle kakhulu kwenza kube yinto ebalulekile kumabhethri e-lithium, ama-PCB, kanye nama-elekthronikhi aguquguqukayo.i-foil yethusi egoqiwe, okuncike ekuguqulweni kwemishini,I-foil yethusi ye-EDikhiqizwa ngokubeka i-electrochemical, okufeza ukulawula kwezinga le-athomu kanye nokwenza ngokwezifiso ukusebenza. Lesi sihloko sembula ukunemba ngemuva kokukhiqizwa kwayo kanye nendlela ukusungula izinto ezintsha okuguqula ngayo izimboni.
I. Ukukhiqizwa Okujwayelekile: Ukunemba Kobunjiniyela Be-Electrochemical
1. Ukulungiswa kwe-Electrolyte: Ifomula Elungiselelwe Kakhulu
I-electrolyte eyisisekelo iqukethe i-sulfate yethusi ehlanzekile kakhulu (80–120g/L Cu²⁺) kanye ne-sulfuric acid (80–150g/L H₂SO₄), kanye ne-gelatin kanye ne-thiourea engezwe emazingeni e-ppm. Izinhlelo ze-DCS ezithuthukisiwe zilawula izinga lokushisa (45–55°C), izinga lokugeleza (10–15 m³/h), kanye ne-pH (0.8–1.5) ngokunemba. Izithasiselo zinamathela ku-cathode ukuze ziqondise ukwakheka kokusanhlamvu kwezinga le-nano futhi zivimbele amaphutha.
2. Ukufakwa kwe-Foil: Ukusebenza Okunembile Kwe-Atomic
Kumaseli e-electrolytic ane-titanium cathode rolls (Ra ≤ 0.1μm) kanye nama-anode e-lead alloy, ugesi we-3000–5000 A/m² DC ushayela ukufakwa kwe-copper ion ebusweni be-cathode ngendlela (220) orientation. Ubukhulu be-foil (6–70μm) bulungiswa kahle ngesivinini sokugoqa (5–20 m/min) kanye nokulungiswa kogesi, kufinyelela ekulawulweni kobukhulu be-±3%. I-foil encane kakhulu ingafinyelela ku-4μm—1/20th ubukhulu bezinwele zomuntu.
3. Ukugeza: Izindawo Ezihlanzekile Kakhulu Ngamanzi Ahlanzekile
Uhlelo lokuhlanza olubuyela emuva olunezigaba ezintathu lususa yonke insalela: Isigaba 1 sisebenzisa amanzi ahlanzekile (≤5μS/cm), Isigaba 2 sisebenzisa amagagasi e-ultrasonic (40kHz) ukukhipha iminonjana yezinto eziphilayo, kanti Isigaba 3 sisebenzisa umoya oshisayo (80–100°C) ukuze komiswe ngaphandle kwamabala. Lokhu kuphumelai-foil yethusingamazinga e-oxygen <100ppm kanye nezinsalela zesulfure <0.5μg/cm².
4. Ukusikwa Nokupakishwa: Ukunemba Kuze Kube Yi-Micron Yokugcina
Imishini yokusika ngesivinini esikhulu enokulawulwa komphetho we-laser iqinisekisa ukubekezelelana kobubanzi ngaphakathi kuka-±0.05mm. Ukupakisha kwe-vacuum anti-oxidation okunezinkomba zomswakama kugcina ikhwalithi yobuso ngesikhathi sokuthuthwa nokugcinwa.
II. Ukwenza Ngokwezifiso Ukwelashwa Komphezulu: Ukuvula Ukusebenza Okuqondene Nemboni
1. Ukwelashwa Kokugoba: Ukunamathela Okuncane Kokuqinisa Ukubopha
Ukwelashwa Kwamaqhubu:I-pulse plating kusisombululo se-CuSO₄-H₂SO₄-As₂O₃ idala amaqhubu angu-2–5μm ebusweni be-foil, okuthuthukisa amandla okunamathela ku-1.8–2.5N/mm—kulungile kakhulu kumabhodi wesekethe angu-5G.
Ukuhluza Okuphindwe Kabili:Izinhlayiya zethusi ezincane nezincane zandisa indawo engaphezulu ngo-300%, okuthuthukisa ukunamathela kwe-slurry kuma-anode ebhethri le-lithium ngo-40%.
2. Ukufakwa Kwesivikelo Esisebenzayo: Izikhali Ze-Molecular-Scale Zokuqina
Ukufakwa kwe-Zinc/Tin:Ingqimba yensimbi engu-0.1–0.3μm yelula ukumelana nokufuthwa kukasawoti kusukela emahoreni angu-4 kuya kwangu-240, okwenza kube yinto ethandwayo kuma-tab ebhethri le-EV.
Isimbozo se-Nickel-Cobalt Alloy:Izendlalelo ze-nano-grain ezifakwe i-pulse (≤50nm) zithola ubulukhuni be-HV350, zisekela ama-substrate agobekayo kuma-smartphone agoqekayo.
3. Ukumelana Nokushisa Okuphezulu: Ukusinda Emazingeni Aphezulu Kakhulu
Izembozo ze-Sol-gel SiO₂-Al₂O₃ (100–200nm) zisiza i-foil ukumelana ne-oxidation ku-400°C (i-oxidation <1mg/cm²), okwenza ifane kahle nezinhlelo zokuxhuma izintambo zezindiza.
III. Ukunika Amandla Imingcele Emithathu Emikhulu Yezimboni
1. Amabhethri Amandla Amasha
I-foil ye-CIVEN METAL engu-3.5μm (≥200MPa ethambile, ≥3% ende) ikhulisa ubuningi bamandla ebhethri angu-18650 ngo-15%. I-foil embozwe ngokwezifiso (30–50% porosity) isiza ukuvimbela ukwakheka kwe-lithium dendrite kumabhethri aqinile.
2. Ama-PCB Athuthukisiwe
I-foil enephrofayili ephansi (LP) ene-Rz ≤1.5μm inciphisa ukulahleka kwesiginali kumabhodi we-5G millimeter-wave ngo-20%. I-foil enephrofayili ephansi (VLP) ene-reverse-treated finish (RTF) isekela amazinga edatha angu-100Gb/s.
3. Izinto Zogesi Eziguquguqukayo
I-AnnealedI-foil yethusi ye-ED(≥ukwelulwa okungu-20%) okufakwe amafilimu e-PI kumela ukugoba okungaphezu kuka-200,000 (irediyasi engu-1mm), okusebenza “njengohlaka oluguquguqukayo” lwezinto ezigqokwayo.
IV. I-CIVEN METAL: Umholi Wokwenza Ngokwezifiso ku-ED Copper Foil
Njengendlu enamandla ethulile ephepheni lethusi le-ED,Insimbi Ecwebezelayoyakhe uhlelo lokukhiqiza olusheshayo nolunesimo esijwayelekile:
Umtapo Wolwazi We-Nano-Additive:Izinhlanganisela ezingaphezu kuka-200 zezithako ezenzelwe amandla aphezulu okubamba, ukunwebeka, kanye nokuqina kokushisa.
Ukukhiqizwa kwe-Foil okuqondiswa yi-AI:Amapharamitha enziwe ngcono nge-AI aqinisekisa ukunemba kobukhulu obungu-±1.5% kanye nokuba yisicaba okungu-≤2I.
Isikhungo Sokwelapha Okungaphezulu:Imigqa eyi-12 ezinikele enikeza izinketho ezingaphezu kuka-20 ezingenziwa ngezifiso (ukukhanda, ukupenda, ukumboza).
Ukuqamba Izindleko:Ukutholwa kwemfucuza emugqeni kukhulisa ukusetshenziswa kwethusi eluhlaza kube ngu-99.8%, kunciphisa izindleko zefoyili ngokwezifiso ngo-10–15% ngaphansi kwesilinganiso semakethe.
Kusukela ekulawuleni i-athomu ye-lattice kuya ekulungiseni ukusebenza kwe-macro-scale,I-foil yethusi ye-EDimelela inkathi entsha yobunjiniyela bezinto ezibonakalayo. Njengoba ushintsho lomhlaba wonke oluya ekufakweni kukagesi namadivayisi ahlakaniphile lushesha,Insimbi Ecwebezelayoihola leli qembu ngemodeli yalo "yokunemba kwe-athomu + ukusungula izinto ezintsha"—iqhubekisela phambili ukukhiqizwa kweShayina okuthuthukile esicongweni seketanga lenani lomhlaba wonke.
Isikhathi sokuthunyelwe: Juni-03-2025