I-Smart Manufacturing Code of Electrodeposited Copper Foil: From Atomic-Level Deposition to Industry Customization Revolution

I-Electrodeposited (ED)ucwecwe lwethusiiwumgogodla ongabonakali wezinto zikagesi zesimanje. Iphrofayili yayo emincane kakhulu, i-ductility ephezulu, kanye nokusebenza kahle kakhulu kuyenza ibaluleke kakhulu kumabhethri e-lithium, ama-PCB, nama-electronics aguquguqukayo. Ngokungafanii-foil yethusi egoqwe, encike ekuguqulweni komshini,ED ucwecwe lwethusiikhiqizwa yi-electrochemical deposition, ifinyelela ukulawulwa kwezinga le-athomu nokwenza ngokwezifiso ukusebenza. Lesi sihloko sembula ukunemba ngemuva kokukhiqizwa kwayo nokuthi inqubo emisha ishintsha kanjani izimboni.

I. Ukukhiqizwa Okujwayelekile: Ukunemba Kubunjiniyela be-Electrochemical

1. Ukulungiselela i-Electrolyte: I-Nano-Optimized Formula
I-electrolyte eyisisekelo iqukethe i-high-purity copper sulfate (80–120g/L Cu²⁺) ne-sulfuric acid (80–150g/L H₂SO₄), ne-gelatin ne-thiourea yengezwe kumazinga we-ppm. Amasistimu e-DCS athuthukisiwe aphatha izinga lokushisa (45–55°C), izinga lokugeleza (10–15 m³/h), kanye ne-pH (0.8–1.5) ngokunemba. Izithasiselo zikhangisa ku-cathode ukuze ziqondise ukwakheka kokusanhlamvu kweleveli ye-nano futhi zivimbele amaphutha.

2. I-Foil Deposition: I-Atomic Precision in Action
Kumaseli e-electrolytic ane-titanium cathode rolls (Ra ≤ 0.1μm) kanye nama-anode engxubevange eholayo, 3000–5000 A/m² DC yamanje ishayela ukufakwa kwe-ion yethusi endaweni ye-cathode ku-(220) orientation. Ugqinsi lwe-foil (6–70μm) lushunwa kahle ngesivinini sokuqengqeleka (5–20 m/min) nokulungiswa kwamanje, kufinyelela ukulawula ukujiya okungu-±3%. Icwecwe elincane kakhulu lingafinyelela ku-4μm—1/20th ukujiya kwezinwele zomuntu.

3. Ukugeza: Indawo Ehlanzeke Kakhulu Ngamanzi Ahlanzekile
Uhlelo lokuhlanekezela olunezigaba ezintathu lususa zonke izinsalela: Isigaba 1 sisebenzisa amanzi ahlanzekile (≤5μS/cm), Isigaba 2 sisebenzisa amagagasi e-ultrasonic (40kHz) ukuze sikhiphe iminonjana yezinto eziphilayo, futhi Isigaba sesi-3 sisebenzisa umoya oshisayo (80–100°C) ukuze somele ngaphandle kwamabala. Lokhu kubangela ukuthiucwecwe lwethusinamazinga komoyampilo <100ppm nezinsalela zesulfure <0.5μg/cm².

4. Ukusika nokupakisha: Ukunemba ku-Micron yokugcina
Imishini yokuhlinza enesivinini esikhulu enokulawula onqenqemeni lwe-laser iqinisekisa ukubekezelelana kobubanzi phakathi kuka-±0.05mm. Ukupakishwa kwe-vacuum anti-oxidation enezinkomba zomswakama kulondoloza ikhwalithi ephezulu ngesikhathi sokuthutha nokugcinwa.

II. Ukwenza Ngokwezifiso Ukwelapha Okuphezulu: Ukuvula Ukusebenza Okuthize Kwemboni

1. Ukwelapha Okuqinile: I-Micro-Anchoring ye-Bonding Ethuthukisiwe

Ukwelashwa kwamanodule:I-Pulse plating ku-CuSO₄-H₂SO₄-As₂O₃ isisombululo sidala ama-nodule angu-2–5μm endaweni ye-foil, ithuthukisa amandla okunamathela abe ngu-1.8–2.5N/mm—afanele amabhodi esekethe e-5G.

I-Dual-Peak Roughening:Izinhlayiya zethusi ze-Micro- kanye ne-nano-scale zandisa indawo engaphezulu ngo-300%, zithuthukisa ukunamathela kwe-slurry ku-anode yebhethri ye-lithium ngo-40%.

2. Ukucwenga Okusebenzayo: Izikhali Ze-Molecular-Scale Zokuqina

I-Zinc/Tin Plating:Isendlalelo sensimbi esingu-0.1–0.3μm sinweba ukumelana nesifutho sikasawoti ukusuka emahoreni angu-4 kuye kwangama-240, sikwenze kube ukuya kumathebhu webhethri le-EV.

I-Nickel-Cobalt Alloy Coating:Izendlalelo ze-Pulse-plated nano-grain (≤50nm) zifinyelela ubulukhuni be-HV350, zisekela ama-substrates agobekayo ama-smartphones asongekayo.

3. Ukumelana Nokushisa Okuphezulu: Ukusinda Ngokwedlulele
I-Sol-gel SiO₂-Al₂O₃ coatings (100–200nm) isiza i-foil ukumelana ne-oxidation ku-400°C (i-oxidation <1mg/cm²), iyenze ifane kahle kakhulu nezinhlelo zezintambo ze-aerospace.

III. Ukunikeza Amandla Imingcele Emithathu Yezimboni

1. Amabhethri Amandla Amasha
Icwecwe le-CIVEN METAL elingu-3.5μm (≥200MPa tensile, ≥3% elongation) linyusa ukuminyana kwamandla ebhethri angu-18650 ngo-15%. I-foil eyenziwe ngokwezifiso (30–50% porosity) isiza ukuvimbela ukwakheka kwe-lithium dendrite kumabhethri esimo esiqinile.

2. Ama-PCB Athuthukile
I-foil enephrofayili ephansi (LP) ene-Rz ≤1.5μm yehlisa ukulahleka kwesignali kumabhodi wamaza wamagagasi angu-5G millimeter ngo-20%. I-Ultra-low profile (VLP) foil ene-reverse-treated finish (RTF) isekela amanani edatha angu-100Gb/s.

3. I-Flexible Electronics
I-AnnealedED ucwecwe lwethusi(≥20% elongation) enamafilimu e-PI amelana nokugoba okungaphezu kuka-200,000 (indawo eyi-1mm), esebenza “njengohlaka lwamathambo oluguquguqukayo” lwezinto ezigqokekayo.

IV. I-CIVEN METAL: Umholi Wokwenza Ngokwezifiso ku-ED Copper Foil

Njengendlu yamandla ethule ku-ED copper foil,I-CIVEN METALyakhe isistimu yokukhiqiza eguquguqukayo, eyi-modular:

I-Nano-Additive Library:Izinhlanganisela ezingaphezu kuka-200 ezenzelwe amandla aqinile, ubude, nokuzinza kwe-thermal.

I-AI-Guided Foil Production:Amapharamitha alungiselelwe i-AI aqinisekisa ukunemba kogqinsi okungu-±1.5% kanye nokucaba okungu-≤2I.

Ihabhu Lokwelapha Elingaphezulu:Imigqa eyi-12 enikelwe enikeza izinketho ezingama-20+ ezenziwe ngokwezifiso (i-roughening, i-plating, i-coatings).

Izindleko zokuqamba:Ukutholwa kwemfucuza emgqeni kukhulisa ukusetshenziswa kwethusi okungaphekiwe kuye ku-99.8%, kunciphisa izindleko zefoil yangokwezifiso ngo-10-15% ngaphansi kwesilinganiso semakethe.

Ukusuka ekulawulweni kwe-lattice ye-athomu kuya ekulungiseni ukusebenza kwesikali esikhulu,ED ucwecwe lwethusiimele inkathi entsha yobunjiniyela bezinto ezibonakalayo. Njengoba inguquko yomhlaba wonke ebheke ekufakeni ugesi namadivayisi ahlakaniphile ikhula ngesivinini,I-CIVEN METALihola inkokhiso ngemodeli yayo “yokunemba kwe-athomu + yokusungula uhlelo lokusebenza”—iphushela ukukhiqizwa kwaseShayina okuthuthukisiwe kuye phezulu kuchungechunge lwenani lomhlaba.