I-copper foilinezinga eliphansi le-oxygen engaphezulu futhi ingaxhunyaniswa nezinhlobonhlobo zama-substrates ahlukene, njengensimbi, izinto zokuvikela. Futhi i-foil yethusi isetshenziswa kakhulu ekuvikelweni kwe-electromagnetic kanye ne-antistatic. Ukubeka ucwecwe lwethusi lwe-conductive endaweni engaphansi futhi ihlanganiswe ne-substrate yensimbi, izohlinzeka ngokuqhubekayo okuhle kakhulu nokuvikela i-electromagnetic. Ingahlukaniswa ibe: ucwecwe lwethusi oluzinamathelayo, ucwecwe lwethusi olulodwa oluseceleni, ucwecwe lwethusi oluseceleni oluphindwe kabili nokunye okunjalo.

Kulesi siqephu, uma uzofunda kabanzi mayelana ne-copper foil kwinqubo yokukhiqiza ye-PCB, sicela uhlole futhi ufunde okuqukethwe ngezansi kulesi siqephu ukuze uthole ulwazi olwengeziwe lomsebenzi.

Yiziphi izici ze-foil yethusi ekukhiqizeni i-PCB?

PCB ucwecwe lwethusiugqinsi lwethusi lokuqala olusetshenziswa ezingqimbeni zangaphandle nezingaphakathi zebhodi le-PCB elinezingqimba eziningi. Isisindo sethusi sichazwa njengesisindo (ngama-ounces) sethusi esikhona endaweni eyodwa yesikwele. Le parameter ibonisa ukushuba okuphelele kwethusi kungqimba. I-MADPCB isebenzisa izisindo zethusi ezilandelayo ekwenzeni i-PCB (i-pre-plate). Isisindo sikalwa ngo-oz/ft2. Isisindo sethusi esifanele singakhethwa ukuze sivumelane nemfuneko yokuklama.

· Ekwenziweni kwe-PCB, ama-foil ethusi asemiqulu, okuyi-electronic grade enobumsulwa obungu-99.7%, nogqinsi luka-1/3oz/ft2 (12μm noma 0.47mil) – 2oz/ft2 (70μm noma 2.8mil).

· Icwecwe lethusi linezinga eliphansi le-oksijini engaphezulu futhi lingaxhunywa ngaphambili ngabakhiqizi be-laminate ezintweni eziyisisekelo ezihlukahlukene, njengensimbi, i-polyimide, i-FR-4, i-PTFE ne-ceramic, ukuze kukhiqizwe ama-laminates agqoke ithusi.

· Ingase futhi yethulwe ebhodini multilayer njengoba ucwecwe yethusi uqobo ngaphambi ngokucindezela.

· Ekwenziweni okuvamile kwe-PCB, ukujiya kwethusi kokugcina ezingqimbeni zangaphakathi kusasele kucwecwe lokuqala lethusi; Kuzendlalelo zangaphandle sinamathisela ithusi elengeziwe elingu-18-30μm kumathrekhi ngesikhathi senqubo yokucwenga yamaphaneli.

· Ithusi lezendlalelo zangaphandle zamabhodi we-multilayer isesimweni se-copper foil futhi icindezelwe kanye nama-prepregs noma ama-cores. Ukuze isetshenziswe nama-microvias ku-HDI PCB, i-copper foil iku-RCC ngqo (resin coated copper).

Kungani i-foil yethusi idingeka ekukhiqizeni i-PCB?

Ucwecwe lwethusi lwe-elekthronikhi (ukuhlanzeka okungaphezu kuka-99.7%, ukujiya okungu-5um-105um) kungenye yezinto eziyisisekelo embonini ye-elekthronikhi Ukuthuthukiswa okusheshayo kwemboni yolwazi lwe-elekthronikhi, ukusetshenziswa kwe-foil yethusi ebangeni le-elekthronikhi kuyakhula, imikhiqizo isetshenziswa kabanzi. ezibalini zezimboni, imishini yezokuxhumana, okokusebenza kwe-QA, amabhethri e-lithium-ion, amasethi kamabonakude avamile, amarekhodi evidiyo, izidlali ze-CD, amakhophi, ucingo, isimo somoya, i-automotive electronics, ama-game consoles.

I-foil yethusi yezimboniingahlukaniswa ngezigaba ezimbili: ucwecwe lwethusi olugoqiwe (ucwecwe lwethusi lwe-RA) kanye nocwecwe lwethusi lwephoyinti (ucwecwe lwethusi lwe-ED), lapho ucwecwe lwethusi lwekhalenda lune-ductility enhle nezinye izici, inqubo yokuqala yepuleti elithambile elisetshenziswa ucwecwe Lwethusi, kuyilapho I-electrolytic copper foil iyizindleko eziphansi zokukhiqiza ucwecwe lwethusi. Njengoba i-foil yethusi egoqayo iyimpahla ebalulekile yebhodi elithambile, ngakho-ke izici zekhalenda ye-foil yethusi kanye nezinguquko zentengo embonini yebhodi elithambile zinomthelela othile.

Yimiphi imithetho eyisisekelo yokuklama yefoyili yethusi ku-PCB?

Uyazi ukuthi amabhodi esekethe ephrintiwe avame kakhulu eqenjini electronics? Nginesiqiniseko sokuthi eyodwa ikhona kudivayisi ye-elekthronikhi oyisebenzisayo njengamanje. Nokho, ukusebenzisa lezi zisetshenziswa zikagesi ngaphandle kokuqonda ubuchwepheshe bazo kanye nendlela yokuklama nakho kuwumkhuba ovamile. Abantu basebenzisa izinto zikagesi njalo ngehora elilodwa kodwa abazi ukuthi zisebenza kanjani. Ngakho-ke nazi izingxenye eziyinhloko ze-PCB ezishiwo ukuthi zibe nokuqonda okusheshayo kokuthi amabhodi esifunda aphrintiwe asebenza kanjani.

· Ibhodi lesifunda eliphrintiwe lingamabhodi epulasitiki alula ngokufakwa kwengilazi. I-foil yethusi isetshenziselwa ukulandelela izindlela futhi ivumela ukugeleza kwamashaji namasignali ngaphakathi kwedivayisi. Imikhondo yethusi iyindlela yokunikeza amandla ezingxenyeni ezahlukene zedivayisi kagesi. Esikhundleni sezintambo, imikhondo yethusi iqondisa ukuhamba kwezindleko kuma-PCB.

· Ama-PCB angaba ungqimba olulodwa nezingqimba ezimbili futhi. I-PCB enezingqimba eyodwa yilezo ezilula. Zine-foiling yethusi ngakolunye uhlangothi kanti olunye uhlangothi yigumbi lezinye izingxenye. Ngenkathi iku-PCB enezendlalelo ezimbili, izinhlangothi zombili zigcinelwe ukufoliswa kwethusi. Anezendlalelo ezikabili ama-PCB ayinkimbinkimbi anemikhondo eyinkimbinkimbi yokuhamba kwezindleko. Awekho ama-foil ethusi angaphambana. Lawa ma-PCB ayadingeka kumishini kagesi esindayo.

· Kukhona futhi izingqimba ezimbili zama-solder kanye nesikrini sikasilika ku-PCB yethusi. Imaski ye-solder isetshenziswa ukuhlukanisa umbala we-PCB. Kukhona imibala eminingi yama-PCB atholakalayo njengohlaza, onsomi, obomvu, njll. Imaski ye-Solder iphinda icacise ithusi elisuka kwezinye izinsimbi ukuze kuqondwe ubunkimbinkimbi bokuxhumana. Ngenkathi isikrini sikasilika siyingxenye yombhalo ye-PCB, izinhlamvu nezinombolo ezihlukene zibhalwa kusikrini sikasilika zomsebenzisi kanye nonjiniyela.

Ungayikhetha kanjani into efanele ye-foil yethusi ku-PCB?

Njengoba kushiwo ngaphambili, udinga ukubona indlela yesinyathelo ngesinyathelo sokuqonda iphethini yokukhiqiza yebhodi lesifunda eliphrintiwe. Izindwangu zala mabhodi ziqukethe izingqimba ezihlukene. Ake sikuqonde lokhu ngokulandelana:

I-substrate material:

Isisekelo esiyisisekelo phezu kwebhodi lepulasitiki eliphoqelelwe ngengilazi yi-substrate. I-substrate iyisakhiwo se-dielectric seshidi ngokuvamile elenziwe ngama-epoxy resins kanye nephepha lengilazi. I-substrate iklanywe ngendlela yokuthi ikwazi ukuhlangabezana nemfuneko ngokwesibonelo izinga lokushisa lokuguquka (TG).

I-Lamination:

Njengoba kusobala egameni, i-lamination iphinde ibe yindlela yokuthola izakhiwo ezidingekayo njengokunwetshwa kwe-thermal, amandla okugunda, nokushisa koshintsho (TG). I-Lamination yenziwa ngaphansi kwengcindezi ephezulu. I-Lamination kanye ne-substrate ndawonye kudlala indima ebalulekile ekuhambeni kwamashaji kagesi ku-PCB.