I-HTE Electrodeposited Copper Foils ye-PCB

Incazelo emfushane:

I-electrolytic copper foil ekhiqizwa yi-CIVEN METAL inokumelana okuhle kakhulu nokushisa okuphezulu kanye ne-ductility ephezulu.I-foil yethusi ayifaki i-oxidize noma iguqule umbala emazingeni okushisa aphezulu, futhi i-ductility yayo enhle yenza kube lula ukucwenga nezinye izinto.


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Isingeniso Somkhiqizo

I-electrolytic copper foil ekhiqizwa yi-CIVEN METAL inokumelana okuhle kakhulu nokushisa okuphezulu kanye ne-ductility ephezulu.I-foil yethusi ayifaki i-oxidize noma iguqule umbala emazingeni okushisa aphezulu, futhi i-ductility yayo enhle yenza kube lula ukucwenga nezinye izinto.I-foil yethusi ekhiqizwa inqubo ye-electrolysis inobuso obuhlanzekile kakhulu kanye nesimo seshidi eliyisicaba.I-foil yethusi ngokwayo i-roughened ngakolunye uhlangothi, okwenza kube lula ukunamathela kwezinye izinto.Ukuhlanzeka okuphelele kwe-foil yethusi kuphezulu kakhulu, futhi inokusebenza okuhle kakhulu kagesi kanye ne-thermal.Ukuze sihlangabezane nezidingo zamakhasimende ethu, asikwazi ukunikeza hhayi kuphela imiqulu ye-foil yethusi, kodwa futhi nezinsizakalo zokusika ezenziwe ngokwezifiso.

Imininingwane

Ubukhulu: 1/4OZ~20OZ(9µm~70µm)

Ububanzi: 550mm ~ 1295mm

Ukusebenza

Umkhiqizo unokusebenza okuhle kakhulu kwesitoreji segumbi lokushisa, ukusebenza kokumelana nezinga lokushisa eliphezulu kwe-oxidation, ikhwalithi yomkhiqizo ukuhlangabezana nezimfuneko zeleveli ye-IPC-4562 Ⅱ, Ⅲ.

Izinhlelo zokusebenza

Ifanele zonke izinhlobo zesistimu ye-resin ye-double side, i-multilayer ephrintiwe ibhodi lesifunda.

Izinzuzo

Umkhiqizo usebenzisa inqubo ekhethekile yokwelapha ngaphezulu ukuze kuthuthukiswe ikhono lomkhiqizo lokumelana nokugqwala okuphansi nokunciphisa ingozi yezinsalela zethusi.

Ukusebenza(GB/T5230-2000、IPC-4562-2000)

Ukwahlukanisa

Iyunithi

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Okuqukethwe

%

≥99.8

Isisindo Sendawo

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Amandla Okuqina

I-RT(25℃)

Kg/mm2

≥28

≥30

I-HT(180℃)

≥15

Ukwelula

I-RT(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

I-HT(180℃)

≥4.0

≥5.0

≥6.0

Ubulukhuni

Shiny(Ra)

μm

≤0.4

I-Matte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Amandla e-Peel

I-RT(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Izinga elehlisiwe le-HCΦ(18%-1hr/25℃)

%

≤5.0

Ukushintsha kombala(E-1.0hr/190℃)

%

Kuhle

I-Solder Floating 290 ℃

Isiqephu

≥20

Iphinikhodi

EA

Uziro

Preperg

----

FR-4

Qaphela:1. Inani le-Rz le-copper foil gross surface yinani elizinzile lokuhlola, hhayi inani eliqinisekisiwe.

2. Amandla epeel yinani elijwayelekile lokuhlola ibhodi le-FR-4 (amashidi angu-5 we-7628PP).

3. Isikhathi sokuqinisekisa ikhwalithi yizinsuku ezingama-90 kusukela ngosuku etholwe ngalo.


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