[RTF] Ukubuyiselwa emuva kwelashwa i-Folip Foil
![[RTF] Ukubuyiselwa emuva kwelashwa isithombe se-Fost Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Isingeniso Somkhiqizo
I-RTF, ukubuyela emuva kwelashwa i-electrolytic yethusi ye-electrolytic yi-foil yethusi eye yathuthukiswa ngamazinga ahlukahlukene ezinhlangothini zombili. Lokhu kuqinisa amandla e-peece azinhlangothi zombili ze-foil yethusi, okwenza kube lula ukuyisebenzisa njengesendlalelo esiphakathi sokubopha ezinye izinto zokwakha. Ngaphezu kwalokho, amazinga ahlukene wokwelashwa ezinhlangothini zombili ze-Foil Foil zenza kube lula ukuthengisa uhlangothi oluncane lwesendlalelo esibiwe. Esezinhlelweni zokwenza iphaneli yesekethe yesekethe ephrintiwe (PCB), uhlangothi oluphathwe khona lwethusi lusetshenziswa ezintweni ezibonakalayo ze-dielectric. Uhlangothi lwesigubhu esiphethwe luqine kunolunye uhlangothi, olukhana ngokunamathela okukhulu ku-dielectric. Le yinzuzo enkulu ngaphezulu kwe-Electrolytic yethusi evamile. Uhlangothi lwe-matte aludingi ukwelashwa okwenziwe ngomshini noma kwamakhemikhali ngaphambi kokusetshenziswa kwe-Photoresist. Sekuvele ngokwanele ukuba nama-lamion amahle wokumelana.
Ukucacisa
I-Civen ingahlinzeka nge-foil ye-stf electrolytic ye-rtf ngosayizi ongama-12 kuye kwangama-35μm kuze kube yi-1295mm ububanzi.
Ukwenza
I-excation ephezulu yokushisa ibuyiselwe emuva kwe-electrolytic yethusi yethusi ye-electrolytic ibhekwe kwinqubo eqondile yokulawula ukulawula usayizi wethumba lethusi futhi uwahangele ngokulinganayo. I-Revessed Phored FourHed FourH ORD FOOL FOIL inganciphisa kakhulu ubulukhuni be-foil ye-topper icindezelwe ndawonye futhi inikeze amandla anele we-foil foil. (Bheka Ithebula 1)
Izinja
Ingasetshenziselwa imikhiqizo evame ukwenzeka kanye nama-laminate angaphakathi, njengeziteshi ze-5G Base kanye ne-radar yezimoto neminye imishini.
Izinzuzo
Amandla amahle obusolwa, ukuqondiswa okuqondile okuphezulu kwe-multing, kanye nokusebenza okuhle kwe-etching. Iphinde yehlise amandla okujikeleza okufushane futhi anciphise isikhathi sokujikeleza inqubo.
Ithebula 1. Ukusebenza
| Ukuhlela ngohlobo oluthile | Umuvo | 1 / 3oz (12μm) | 1 / 2oz (18μm) | 1oz (35μm) | |
| Okuqukethwe kwe-CU | % | imiz. 99.8 | |||
| Indawo yendawo | g / m2 | 107 ± 3 | 153 ± 5 | 283 ± 5 | |
| Amandla asheshayo | I-RT (25 ℃) | Kg / mm2 | imiz. 28.0 | ||
| Ht (180 ℃) | imiz. 15.0 | imiz. 15.0 | imiz. 18.0 | ||
| Elongation | I-RT (25 ℃) | % | imiz. I-5 | imiz. I- | imiz. 8.0 |
| Ht (180 ℃) | imiz. I- | ||||
| Ukubaluleka | Shiny (RA) | μM | UMax. I-0.6 / 4.0 | UMax. 0.7 / 5.0 | UMax. 0.8 / 6.0 |
| Matte (rz) | UMax. I-0.6 / 4.0 | UMax. 0.7 / 5.0 | UMax. 0.8 / 6.0 | ||
| Amandla we-PEEC | I-RT (23 ℃) | Kg / cm | imiz. 1.1 | imiz. 1.2 | imiz. 1.5 |
| Izinga Lonakalisiwe le-HC Lφ (18% -1HR / 25 ℃) | % | UMax. I-5 | |||
| Ukushintshwa kombala (i-E-1.0HR / 190 ℃) | % | Namunye | |||
| Solder intanta 290 ℃ | Sec. | UMax. 20 | |||
| Inkothombisa | EA | Okungekho | |||
| Umphambili | ---- | Fr-4 | |||
Qaphela:1. Inani le-RZ le-Copper Foil Grop Surpor GROCK yinani lokuhlola elizinzile, hhayi inani eliqinisekisiwe.
2. Amandla we-PEEL yinani lokuhlola lebhodi elijwayelekile le-FR-4 (amashidi ama-5 we-7628pp).
3. Isikhathi sokuqinisekisa ikhwalithi yizinsuku ezingama-90 kusukela ngosuku lokutholwa.
![[HTE] High Elongation Ed Copper Foil](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[VLP] I-Folip ye-Popper ephansi kakhulu](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[BCF] ibhethri ed yethusi i-foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
