[RTF] I-Reverse Treated ED Copper Foil
![[RTF] Isithombe Esifakiwe Esihlanganisiwe Se-ED Copper Reverse Treated](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Isingeniso Somkhiqizo
I-RTF, ucwecwe lwe-electrolytic copper olulaphelwe ukuhlanekezela luyi-foil yethusi eye yaqina yaba ngamadigri ahlukahlukene nhlangothi zombili. Lokhu kuqinisa amandla e-peel ezinhlangothini zombili ze-foil yethusi, okwenza kube lula ukuyisebenzisa njengesendlalelo esimaphakathi sokubopha kwezinye izinto. Ngaphezu kwalokho, amazinga ahlukene okwelapha kuzo zombili izinhlangothi zefoyili yethusi enza kube lula ukunamathisela uhlangothi oluncane lwesendlalelo esiqinile. Enkambweni yokwenza iphaneli yebhodi lesifunda ephrintiwe (PCB), uhlangothi oluphathwayo lwethusi lusetshenziswa ezintweni ze-dielectric. Uhlangothi lwesigubhu olulashiwe luqinile kunolunye uhlangothi, olwenza ukunamathela okukhulu ku-dielectric. Lena inzuzo eyinhloko ngaphezu kwethusi elijwayelekile le-electrolytic. Uhlangothi lwe-matte aludingi ukwelashwa kwemishini noma kwamakhemikhali ngaphambi kokusetshenziswa kwe-photoresist. Isivele ilukhuni ngokwanele ukuba ibe nokunamathela okuhle kwe-laminating ukumelana.
Imininingwane
I-CIVEN inganikeza i-RTF icwecwe lethusi le-electrolytic elinogqinsi oluyi-12 ukuya ku-35µm olufika kububanzi obungu-1295mm.
Ukusebenza
Ukwelulwa kwezinga lokushisa okuphezulu okubuyiselwe emuva kwe-electrolytic copper foil ingaphansi kwenqubo yokucwenga enembile ukuze kulawulwe usayizi wamathumba ekhopha futhi kusakazwe ngokulinganayo. Indawo ekhanyayo elungisiwe elungisiwe yefoyili yethusi inganciphisa ngokuphawulekayo ukukhahlamezeka kwefoyili yethusi ecindezelwe ndawonye futhi inikeze amandla anele ekhasi lefoyili yethusi. (Bheka ithebula 1)
Izinhlelo zokusebenza
Ingasetshenziselwa imikhiqizo yamafrikhwensi aphezulu namalayini angaphakathi, njengeziteshi eziyisisekelo ze-5G kanye ne-radar yezimoto nezinye izinto zokusebenza.
Izinzuzo
Amandla amahle okubopha, ukunqwabelana okuqondile kwezingqimba eziningi, nokusebenza okuhle kwe-etching. Iphinde inciphise amandla okujikeleza okufushane futhi ifinyeze isikhathi somjikelezo wenqubo.
Ithebula 1. Ukusebenza
| Ukwahlukanisa | Iyunithi | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Cu Okuqukethwe | % | imiz. 99.8 | |||
| Isisindo Sendawo | g/m2 | 107±3 | 153±5 | 283±5 | |
| Amandla Okuqina | I-RT(25℃) | Kg/mm2 | imiz. 28.0 | ||
| I-HT(180℃) | imiz. 15.0 | imiz. 15.0 | imiz. 18.0 | ||
| Ukwelula | I-RT(25℃) | % | imiz. 5.0 | imiz. 6.0 | imiz. 8.0 |
| I-HT(180℃) | imiz. 6.0 | ||||
| Ubulukhuni | Shiny(Ra) | μm | ubuningi. 0.6/4.0 | ubuningi. 0.7/5.0 | ubuningi. 0.8/6.0 |
| I-Matte(Rz) | ubuningi. 0.6/4.0 | ubuningi. 0.7/5.0 | ubuningi. 0.8/6.0 | ||
| Amandla e-Peel | I-RT(23℃) | Kg/cm | imiz. 1.1 | imiz. 1.2 | imiz. 1.5 |
| Izinga elehlisiwe le-HCΦ(18%-1hr/25℃) | % | ubuningi. 5.0 | |||
| Ukushintsha kombala(E-1.0hr/190℃) | % | Lutho | |||
| I-Solder Floating 290 ℃ | Isiqephu | ubuningi. 20 | |||
| Iphinikhodi | EA | Uziro | |||
| Preperg | ---- | FR-4 | |||
Qaphela:1. Inani le-Rz le-copper foil gross surface yinani elizinzile lokuhlola, hhayi inani eliqinisekisiwe.
2. Amandla e-peel yinani elijwayelekile lokuhlola ibhodi le-FR-4 (amashidi angu-5 we-7628PP).
3. Isikhathi sokuqinisekisa ikhwalithi yizinsuku ezingama-90 kusukela ngosuku etholwe ngalo.
![[BCF] Icwecwe Lethusi le-ED](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] Iphrofayili ephansi kakhulu ye-ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[HTE] Icwecwe Lethusi Le-ED Elinezelo Eliphezulu](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
