[RTF] I-Reverse Treated ED Copper Foil
![[RTF] Isithombe Esifakiwe Se-Reverse Treated ED Copper Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Isingeniso Somkhiqizo
I-RTF, i-foil yethusi ephathwe nge-electrolytic ebuyiselwe emuva, iyi-foil yethusi ehlungwe ngamazinga ahlukahlukene kuzo zombili izinhlangothi. Lokhu kuqinisa amandla okubopha kwezinhlangothi zombili ze-foil yethusi, okwenza kube lula ukuyisebenzisa njengesendlalelo esiphakathi sokubopha kwezinye izinto. Ngaphezu kwalokho, amazinga ahlukene okwelashwa kuzo zombili izinhlangothi ze-foil yethusi enza kube lula ukuqopha uhlangothi oluncane lwesendlalelo esihlungwe. Enkambisweni yokwenza iphaneli yebhodi lesifunda eliphrintiwe (i-PCB), uhlangothi oluphathwe ngethusi lusetshenziswa ezintweni ze-dielectric. Uhlangothi lwesigubhu oluphathwe nge-electrolytic lulukhuni kunolunye uhlangothi, okwakha ukunamathela okukhulu kwi-dielectric. Lena inzuzo enkulu ngaphezu kwethusi elijwayelekile le-electrolytic. Uhlangothi olu-matte aludingi ukwelashwa kwemishini noma kwamakhemikhali ngaphambi kokusetshenziswa kwe-photoresist. Seluvele luqinile ngokwanele ukuba lube nokunamathela okuhle kwe-laminating resist.
Imininingwane
I-CIVEN ingahlinzeka nge-RTF electrolytic copper foil enobukhulu obungu-12 kuya ku-35µm kufika ku-1295mm ububanzi.
Ukusebenza
I-foil yethusi elashwe nge-electrolytic elashwe ngokushisa okuphezulu ifakwa enkambisweni eqondile yokubopha ukuze kulawulwe usayizi wezimila zethusi futhi zisabalaliswe ngokulinganayo. Ubuso obukhanyayo obulashwe ngokuguqulwa kwefoil yethusi bunganciphisa kakhulu ubulukhuni befoil yethusi ecindezelwe ndawonye futhi bunikeze amandla anele okubopha kwefoil yethusi. (Bheka Ithebula 1)
Izicelo
Ingasetshenziswa emikhiqizweni evamise kakhulu kanye nama-laminate angaphakathi, njengeziteshi zesisekelo ze-5G kanye ne-radar yezimoto kanye neminye imishini.
Izinzuzo
Amandla amahle okubopha, i-lamination eqondile enezingqimba eziningi, kanye nokusebenza okuhle kokuqopha. Futhi kunciphisa amandla okujikeleza okufushane futhi kunciphisa isikhathi somjikelezo wenqubo.
Ithebula 1. Ukusebenza
| Ukuhlukaniswa | Iyunithi | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Okuqukethwe kwe-Cu | % | ubuncane 99.8 | |||
| Isisindo Sendawo | g/m2 | 107±3 | 153±5 | 283±5 | |
| Amandla Okudonsa | I-RT(25℃) | kg/mm2 | ubuncane 28.0 | ||
| I-HT(180℃) | ubuncane 15.0 | ubuncane 15.0 | ubuncane 18.0 | ||
| Ukwelulwa | I-RT(25℃) | % | ubuncane 5.0 | ubuncane 6.0 | ubuncane 8.0 |
| I-HT(180℃) | ubuncane 6.0 | ||||
| Ubulukhuni | Shiny(Ra) | μm | ubuningi 0.6/4.0 | ubuningi. 0.7/5.0 | ubuningi. 0.8/6.0 |
| I-Matte(Rz) | ubuningi 0.6/4.0 | ubuningi. 0.7/5.0 | ubuningi. 0.8/6.0 | ||
| Amandla Okuhluza | I-RT(23℃) | Amakhilogremu/cm | ubuncane 1.1 | ubuncane 1.2 | ubuncane 1.5 |
| Izinga eliphansi le-HCΦ(18%-1hr/25℃) | % | ubuningi. 5.0 | |||
| Ukushintsha kombala (E-1.0hr/190℃) | % | Akukho | |||
| I-Solder Entantayo engu-290℃ | Isekh. | ubuningi obungu-20 | |||
| Imbobo yephini | EA | U-Zero | |||
| I-Preperg | ---- | FR-4 | |||
Qaphela:1. Inani le-Rz lobuso obuphelele be-foil yethusi liyinani elizinzile lokuhlola, hhayi inani eliqinisekisiwe.
2. Amandla okuhluba yinani elijwayelekile lokuhlola ibhodi le-FR-4 (amashidi ama-5 angu-7628PP).
3. Isikhathi sokuqinisekisa ikhwalithi siyizinsuku ezingama-90 kusukela osukwini lokwamukelwa.
![[HTE] I-ED Copper Foil Ende Kakhulu](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Ibhethri ED Ifoyili yethusi](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] I-ED Copper Foil Ephansi Kakhulu](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
