I-Tin Plated Copper Foil
Isingeniso Somkhiqizo
Imikhiqizo yethusi evezwa emoyeni ivame ukubaukushiswa kwe-oxidationkanye nokwakheka kwe-carbonate eyisisekelo yethusi, enokumelana okuphezulu, ukuhanjiswa kukagesi okungekuhle kanye nokulahlekelwa ukudluliselwa kwamandla aphezulu; ngemva kokufakwa kwe-tin plating, imikhiqizo yethusi yakha amafilimu e-tin dioxide emoyeni ngenxa yezakhiwo ze-tin metal uqobo ukuvimbela ukuwohloka okwengeziwe.
Izinto Eziyisisekelo
●Okuqukethwe kwe-Copper Foil egoqwe ngokunemba okuphezulu, i-Cu(JIS: C1100/ASTM: C11000) okungaphezu kuka-99.96%
Ububanzi Bokujiya Kwezinto Eziyisisekelo
●0.035mm~0.15mm (0.0013 ~0.0059inches)
Ububanzi Bobubanzi Bezinto Eziyisisekelo
●≤300mm (≤11.8 amayintshi)
Ukushisa Kwezinto Eziyisisekelo
●Ngokwezidingo zamakhasimende
Isicelo
●Izinto zikagesi kanye nezimboni ze-elekthronikhi, ezomphakathi (ezifana: nokupakisha iziphuzo kanye namathuluzi okuxhumana nokudla);
Amapharamitha Okusebenza
| Izinto | I-Tin Plating Eshibilikayo | I-Plating ye-Tin engashiselwe |
| Ububanzi Bebanga | ≤600mm (≤23.62inches) | |
| Ububanzi Bokujiya | 0.012~0.15mm (0.00047inches~0.0059inches) | |
| Ubukhulu bengqimba yethini | ≥0.3µm | ≥0.2µm |
| Okuqukethwe kwe-Tin kwe-Tin Layer | 65~92% (Ingalungisa okuqukethwe kwethini ngokwenqubo yokushisela yamakhasimende) | Ithini Elihlanzekile Eliyi-100% |
| Ukumelana Nomphezulu We-Tin Layer(Ω) | 0.3~0.5 | 0.1~0.15 |
| Ukunamathela | 5B | |
| Amandla Okudonsa | Ukuncishiswa Kokusebenza Kwezinto Eziyisisekelo Ngemva Kokugoqa ≤10% | |
| Ukwelulwa | Ukuncishiswa Kokusebenza Kwezinto Eziyisisekelo Ngemva Kokugoqa ≤6% | |
![[VLP] I-ED Copper Foil Ephansi Kakhulu](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
