[VLP] I-Folip ye-Popper ephansi kakhulu
Isingeniso Somkhiqizo
I-VLP, i-electrolytic ye-electrolytic ephansi kakhulu ekhiqizwe yi-Iveniven Metal inezimpawu zobulukhuni obuphansi namandla aphezulu we-peel. I-Folip Foil ekhiqizwa yinqubo ye-electrolysis inezinzuzo zobumsulwa obuphezulu, ukungcola okuphansi, indawo ebushelelezi, ukwakheka kwebhodi elithambile nobubanzi obukhulu. I-electrolytic yethusi i-foil ingahle ihlukaniswe kangcono nezinye izinto ngemuva kokukhula ohlangothini olulodwa, futhi akulula ukuyicisha.
Ukucacisa
I-Chiven ingongahlinzeka nge-Ultra-Low-Low Heart Light Recile electrolytic Copper foil (VLP) kusuka ku-1 / 4oz kuya ku-35μm kuya ku-105μM), kanye nosayizi womkhiqizo omkhulu ngu-1295mm x 1295mm x 1295mm wephephe i-foil ye-1295mm x 1295mm x 1295mm x 1295mm wephephe lethusi.
Ukwenza
-Luhlonze Inikeza i-foil ye-electrolytic-ye-electrolytic eqinile ye-electrolytic enezindawo ezinhle kakhulu zenyama yekristalu enobuhlakani, iphrofayili ephansi, amandla aphezulu kanye nokukhula okuphezulu. (Bheka Ithebula 1)
Izinja
Kusebenza ekwenziweni kwamabhodi e-High-Power Powercy kanye namabhodi afudumele aphezulu we-autotiotive, amandla kagesi, ukuxhumana, ezempi kanye ne-aerospace.
Izici
Qhathanisa nemikhiqizo efanayo yakwamanye amazwe.
1.Ukwakheka okusanhlamvu kwe-VLP electrolytic yethusi yethusi ye-electrolytic kuyindilinga enhle ye-crystal spherical; Ngenkathi ukwakheka okusanhlamvu kwemikhiqizo efanayo yakwamanye amazwe kunguMkhandlu futhi isikhathi eside.
2. I-electrolytic Copper foil yiphrofayili ephansi ye-Ultra-Low, 3oz Copper foil grop surface RZ ≤ 3.5μm; Ngenkathi imikhiqizo efanayo yakwamanye amazwe iyiphrofayli ejwayelekile, i-3oz yethusi ye-foil gross rz> 3.5μm.
Izinzuzo
1.Since Proct yethu yiphrofayili ephansi ye-Ultra-Low, ixazulula ingozi engaba khona yesifunda esifushane ngenxa yokuphikisana okukhulu kwe-foil ye-foil evamile ye-foil evamile kanye nokungena okulula kwephepha elincanyana lokufaka inyumbazane yi- "Wolf Tooth" lapho ucindezela iphaneli elihlangene.
2.Buka isakhiwo semikhiqizo yethu ukusanhlamvu silingana kahle i-crystal spherical spherical, itfumanisa isikhathi sokuthola umugqa futhi kuthuthukisa inkinga yomugqa ohlangothini olungalingani.
I-3, ngenkathi inamandla we-peel aphezulu, akukho ukudluliswa kwe-popper yethusi, ukusebenza okucacile kwe-PCB kokusebenza kwe-PCB.
Ukusebenza (GB / T5230-2000, IPC-4562-2000)
Ukuhlela ngohlobo oluthile | Umuvo | 9μm | I-12μm | 18μM | 35μM | I-70μM | I-105μM | |
Okuqukethwe kwe-CU | % | ≥99.8 | ||||||
Indawo yendawo | g / m2 | 80 ± 3 | 107 ± 3 | 153 ± 5 | 283 ± 7 | 585 ± 10 | 875 ± 15 | |
Amandla asheshayo | I-RT (23 ℃) | Kg / mm2 | ≥28 | |||||
Ht (180 ℃) | ≥15 | ≥18 | ≥20 | |||||
Elongation | I-RT (23 ℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
Ht (180 ℃) | ≥6.0 | ≥8.0 | ||||||
Ukubaluleka | Shiny (RA) | μM | ≤0.43 | |||||
Matte (rz) | ≤3.5 | |||||||
Amandla we-PEEC | I-RT (23 ℃) | Kg / cm | ≥.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
Izinga Lonakalisiwe le-HC Lφ (18% -1HR / 25 ℃) | % | ≤7.0 | ||||||
Ukushintshwa kombala (i-E-1.0HR / 200 ℃) | % | Kuhle ngokuncomekayo | ||||||
Solder intanta 290 ℃ | Sec. | ≥20 | ||||||
Ukubukeka (Spot kanye ne-Postper Popper) | ---- | Namunye | ||||||
Inkothombisa | EA | Okungekho | ||||||
Ukubekezelela usayizi | Ububanzi | mm | 0 ~ 2mm | |||||
Ubude | mm | ---- | ||||||
Umongo | Mm / inch | Ngaphakathi ububanzi 79mm / 3 inch |
Qaphela:1. Inani le-RZ le-Copper Foil Grop Surpor GROCK yinani lokuhlola elizinzile, hhayi inani eliqinisekisiwe.
2. Amandla we-PEEL yinani lokuhlola lebhodi elijwayelekile le-FR-4 (amashidi ama-5 we-7628pp).
3. Isikhathi sokuqinisekisa ikhwalithi yizinsuku ezingama-90 kusukela ngosuku lokutholwa.